Flexible electronic circuits with embedded integrated circuit die

A flexible integrated circuit (IC) module comprising:

• a flexible substrate;
• a semiconductor die attached to the flexible substrate;
• and
• an encapsulating layer attached to the flexible substrate, the encapsulating layer including a thermoplastic resin or a polyimide adhesive, or both, the semiconductor die being encased between the flexible substrate and the encapsulating layer,
• wherein the thermoplastic resin comprises a B-stage FR-4 glass-reinforced epoxy thermoplastic polymer or copolymer or blend.

A flexible integrated circuit (IC) module comprising:

• a flexible substrate including a layer of flexible polymer and two layers of conductive material, each of the layers of conductive material being disposed on a respective side of the layer of flexible polymer;
• a semiconductor die attached to the flexible substrate;
• and
• an encapsulating layer attached to the flexible substrate, the encapsulating layer including a thermoplastic resin or a polyimide adhesive, or both, the semiconductor die being encased between the flexible substrate and the encapsulating layer.

A flexible integrated circuit (IC) package for an extremely flexible electronic device, the flexible IC package comprising:

• a first flexible substrate including a first layer of flexible polymer and a first pair of layers of conductive material, each of the first layers of conductive material being disposed on a respective side of the first layer of flexible polymer;
• a silicon die attached to the first flexible substrate, the silicon die including a wafer of electronic-grade silicon with an integrated circuit formed thereon;
• a second flexible substrate including a second layer of flexible polymer and a second pair of layers of conductive material, each of the second layers of conductive material being disposed on a respective side of the second layer of flexible polymer;
• and
• an encapsulating layer disposed between and laminated to the first and second flexible substrates, the encapsulating layer including a thermoplastic resin or a polyimide adhesive, or both, encasing the silicon die.