C09J 2203/326
Applications of adhesives in processes or use of adhesives in the form
Official title: for bonding electronic components such as wafers, chips or semiconductors
C09J2203/326 (Applications of adhesives in processes or use of adhesives in the form) appears on 1,239 US grants and 2,283 published applications in this corpus.
Search patents in C09J- Granted patents
- 1,239
- Published applications
- 2,283
- Assignees
- 481
- Inventors
- 3,809
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 5 | 0 |
| 2001 | 6 | 5 |
| 2002 | 6 | 10 |
| 2003 | 11 | 15 |
| 2004 | 14 | 16 |
| 2005 | 13 | 23 |
| 2006 | 8 | 20 |
| 2007 | 6 | 27 |
| 2008 | 6 | 38 |
| 2009 | 14 | 43 |
| 2010 | 17 | 61 |
| 2011 | 27 | 54 |
| 2012 | 25 | 83 |
| 2013 | 20 | 78 |
| 2014 | 27 | 83 |
| 2015 | 36 | 85 |
| 2016 | 47 | 111 |
| 2017 | 60 | 119 |
| 2018 | 78 | 118 |
| 2019 | 93 | 143 |
| 2020 | 108 | 149 |
| 2021 | 81 | 159 |
| 2022 | 94 | 202 |
| 2023 | 93 | 177 |
| 2024 | 114 | 182 |
| 2025 | 122 | 165 |
| 2026 | 88 | 117 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Carrier tape system and methods of making and using the same6 Oct 2026US 12,753,327 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Temporary adhesive material for substrate processing and method for manufacturing laminate6 Oct 2026US 12,753,334 B2Shin-Etsu Chemical Co., Ltd.
- Lightweight rf shielding conductive elastomeric tape29 Sep 2026US 12,747,376 B2Swift Textile Metalizing LLC
- Metal thin film substrate, transparent display comprising same, method for patterning metal thin film substrate, and method for manufacturing transparent display22 Sep 2026US 12,741,445 B2Dongwoo Fine-Chem Co., Ltd.
- Protective sheet, method for producing electronic component, and method for producing glass piece forming display surface of display apparatus22 Sep 2026US 12,742,100 B2Nitto Denko Corporation
- Adhesive resin composition-coated electrical steel sheet and method for producing same8 Oct 2026US 2026/0308418 A1Nippon Steel Corporation
- Resin composition, adhesive member, and electronic apparatus including the adhesive member8 Oct 2026US 2026/0308420 A1Samsung Display Co., Ltd.
- Adhesive film, adhesive film with metal layer, wiring formation member, formation method for wiring layer, and wired member1 Oct 2026US 2026/0297391 A1Resonac Corporation
- Pressure-sensitive adhesive tape1 Oct 2026US 2026/0297396 A1Nitto Denko Corporation
- Roller-type bottom tape iron with reduced adhesive buildup at tail end of iron section24 Sep 2026US 2026/0286190 A1Tokyo Weld Co., Ltd.
Most cited
By later US patents
- Wafer machining adhesive tape, and its manufacturing method and using method162US 7,358,158 B2Mitsui Chemicals, Inc. · 2008
- Electrically and thermally conductive adhesive transfer tape128US 4,606,962 AMinnesota Mining and Manufacturing Company · 1986
- Semiconductor device comprising silicone adhesive sheet64US 6,304,000 B1Dow Corning Toray Silicone Co., Ltd. · 2001
- Semiconductor device with flat protective adhesive sheet and method of manufacturing the same57US 6,245,593 B1Denso Corporation · 2001
- Temporary wafer bonding method for semiconductor processing57US 7,541,264 B2Dow Corning Corporation · 2009