Semiconductor device comprising silicone adhesive sheet
AssigneeDow Corning Toray Silicone Co., Ltd.
InventorsMinoru Isshiki, Katsutoshi Mine, Yoshiko Otani, Kimio Yamakawa
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Abstract
A semiconductor device comprising a semiconductor chip, a semiconductor chip attachment site facing the semiconductor chip, and an adhesive silicone sheet bonding the semiconductor chip to the chip attachment site, wherein at least the surfaces of the sheet that connect the semiconductor chip and chip attachment site are a semi-cured product of a curable silicone composition.
Claims20
A semiconductor device comprising a semiconductor chip, a semiconductor chip attachment site facing the semiconductor chip, and an adhesive silicone sheet bonding the semiconductor chip to the chip attachment site, wherein at least the surfaces of the sheet that contact the semiconductor chip and chip attachment site are a semi-cured product of a curable silicone composition.
Dependencies are inferred from the claim text.