Semiconductor device with flat protective adhesive sheet and method of manufacturing the same

A method of manufacturing a semiconductor device, comprising:

• preparing a semiconductor wafer having a structure portion exposed on a first surface thereof, and a flat first adhesive sheet holding an adhesive generally on an entire surface thereof, the structure portion having a mechanical strength smaller than that of a vicinal region thereof in the semiconductor wafer;
• attaching the first adhesive sheet to the first surface of the semiconductor wafer to cover the structure portion by a specific region of the first adhesive sheet;
• and
• dicing the semiconductor wafer together with the first adhesive sheet, wherein an adhesion of the adhesive on the specific region is selectively reduced for covering the structure portion before or after attaching the first adhesive sheet to the semiconductor wafer, and before dicing the semiconductor wafer.