C08K 2003/085
Copper
Official title: {Copper}
C08K2003/085 (Copper) appears on 277 US grants and 463 published applications in this corpus.
Search patents in C08K- Granted patents
- 277
- Published applications
- 463
- Assignees
- 286
- Inventors
- 1,104
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 0 |
| 2003 | 1 | 3 |
| 2004 | 1 | 1 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 3 |
| 2011 | 1 | 1 |
| 2012 | 1 | 2 |
| 2013 | 1 | 4 |
| 2014 | 1 | 9 |
| 2015 | 3 | 20 |
| 2016 | 10 | 32 |
| 2017 | 12 | 30 |
| 2018 | 14 | 51 |
| 2019 | 20 | 54 |
| 2020 | 38 | 51 |
| 2021 | 38 | 60 |
| 2022 | 32 | 40 |
| 2023 | 28 | 35 |
| 2024 | 36 | 31 |
| 2025 | 12 | 15 |
| 2026 | 23 | 21 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Copolymer, composition, molded product and coated electrical wire22 Sep 2026US 12,742,028 B2AGC Inc.
- Instrinsically antimicrobial porosic matrix composites and method of manufacture thereof15 Sep 2026US 12,733,637 B2
- Block sponge and production process thereof8 Sep 2026US 12,729,267 B1Guangdong Eonjoy Technology Limited
- Solar additive composition and uses thereof8 Sep 2026US 12,729,311 B2
- Flexible polytetrafluoroethylene substrate with electrical circuit layer and method therefor1 Sep 2026US 12,722,167 B2
- Thermoplastic composition, articles prepared therefrom, and method for the manufacture thereof24 Sep 2026US 2026/0286129 A1Shpp Global Technologies B.V.
- Formulations and processes for producing highly conductive copper patterns3 Sep 2026US 2026/0258271 A1Copprint Technologies Ltd
- Polycarbonate Composition and Shaped Articles Made Therefrom27 Aug 2026US 2026/0250486 A1Covestro Deutschland AG
- Liquid crystal polymer dielectric powder or 3d printed material27 Aug 2026US 2026/0255492 A1LCP Medical Technologies, Inc.
- Modified triblock copolymer compounds and methods of use thereof30 Jul 2026US 2026/0217919 A1Roche Sequencing Solutions, Inc.
Most cited
By later US patents
- Conductive paste composition for via hole filling and printed circuit board using the same32US 6,096,411 AMatsushita Electric Industrial Co., Ltd. · 2000
- Stabilized polyvinylpyrrolidone formulation30US 6,592,900 B1BASF SE · 2003
- Environmentally safe epoxy adhesive-copper hull coating and method20US 5,571,312 ACresco, Inc., SA. · 1996
- Polymer thermal interface material having enhanced thermal conductivity15US 9,070,660 B2Intel Corporation · 2015
- Coating composition14US 4,895,881 AExtensor, LLC · 1990