Polymer thermal interface material having enhanced thermal conductivity
AssigneeIntel Corporation
InventorsRandall Lowe, Jr., Syadwad Jain, James C. Matayabas, Jr.
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Abstract
A polymer thermal interface material is described that has enhanced thermal conductivity. In one example, a vinyl-terminated silicone oil is combined with a silicone chain extender, and a thermally conductive filler comprising at least 85% by weight of the material, and comprising surface wetted particles with a range of shapes and sizes. The material may be used for bonding components inside a microelectronic package, for example.
Claims26
A polymer thermal interface material having a cure temperature, the material comprising:
- a vinyl-terminated silicone oil;
- a silicone chain extender;
- and
- a thermally conductive filler comprising at least 85% by weight of the material, and comprising surface wetted particles with a range of shapes and sizes,
- wherein the surface wetted particles are wetted first with a first agent having a boiling point below the cure temperature of the material and then with a second agent having a boiling point above the cure temperature of the material, and wherein the second agent comprises a silane with an attached alkyl chain;
- wherein the first agent is applied in a quantity sufficient to substantially be adsorbed by the filler particles with substantially no excess first agent that is not adsorbed, and
- wherein the second agent is applied in a quantity sufficient to reduce the viscosity of the material.
A method of making a thermal interface material, the material having a cure temperature, the method comprising:
- surface wetting a plurality of thermal conductive filler particles with a first agent having a boiling point below the cure temperature of the material and then with a second agent having a boiling point above the cure temperature of the material, the second agent comprising a silane with an attached alkyl chain;
- wherein the first agent is applied in a quantity sufficient to substantially be adsorbed by the filler particles with substantially no excess first agent that is not adsorbed, and
- wherein the second agent is applied in a quantity sufficient to reduce the viscosity of the material;
- and
- combining a vinyl-terminated silicone oil, a silicone chain extender, and the wetted filler particles wherein the wetted filler particles are at least 85% by weight of the material.
A semiconductor package comprising:
- a substrate;
- a semiconductor die coupled to the substrate;
- a heat spreader coupled to the die;
- and
- a thermal interface material between the die and the heat spreader to mechanically and thermally couple the heat spreader to the die, the thermal interface material having a cure temperature and comprising:
- a vinyl-terminated silicone oil;
- a silicone chain extender;
- and
- a thermally conductive filler comprising at least 85% by weight of the material, and comprising surface wetted particles with a range of shapes and sizes,
- wherein the surface wetted particles are wetted first with a first agent having a boiling point below the cure temperature of the material and then with a second agent having a boiling point above the cure temperature of the material, and wherein the second agent comprises a silane with an attached alkyl chain,
- wherein the first agent is applied in a quantity sufficient to substantially be adsorbed by the filler particles with substantially no excess first agent that is not adsorbed, and
- wherein the second agent is applied in a quantity sufficient to reduce the viscosity of the material.
A polymer thermal interface material having a cure temperature, the material comprising:
- a vinyl-terminated silicone oil;
- a silicone chain extender;
- and
- a thermally conductive filler comprising at least 85% by weight of the material, and comprising surface wetted particles with a range of shapes and sizes,
- wherein the surface wetted particles are wetted first with a first agent having a boiling point below a cure temperature of the material and then with a second agent, the second agent being a silane with an attached alkyl chain having a boiling point above a cure temperature of the material.
A method of making a thermal interface material having a cure temperature, the material comprising:
- surface wetting a plurality of thermal conductive filler particles with a first agent having a boiling point below the cure temperature of the material and then with a second agent, the second agent being a silane with an attached alkyl chain having a boiling point above the cure temperature of the material;
- and
- combining a vinyl-terminated silicone oil, a silicone chain extender, and the wetted filler particles wherein the wetted filler particles are at least 85% by weight of the material.
A polymer thermal interface material for use in conducting heat between two surfaces, the material comprising:
- a vinyl-terminated silicone oil;
- a silicone chain extender;
- a plurality of thermally conductive filler particles comprising at least 85% by weight of the material;
- a first wetter adsorbed by the filler particles to wet the filler particles;
- and
- a second wetter, including a silane with an attached alkyl chain, free in the silicone oil to wet the two surfaces.
Dependencies are inferred from the claim text.