C08J 2383/16
In which all the silicon atoms are connected by linkages other than
Official title: in which all the silicon atoms are connected by linkages other than oxygen atoms
C08J2383/16 (In which all the silicon atoms are connected by linkages other than) appears on 30 US grants and 41 published applications in this corpus.
Search patents in C08J- Granted patents
- 30
- Published applications
- 41
- Assignees
- 30
- Inventors
- 118
- Latest grant
- 24 Sep 2024
Filings by year
| Year | Granted patents | Published applications |
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| 1989 | 1 | 0 |
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| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
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| 1998 | 0 | 0 |
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| 2003 | 1 | 1 |
| 2004 | 0 | 1 |
| 2005 | 0 | 2 |
| 2006 | 2 | 1 |
| 2007 | 0 | 1 |
| 2008 | 2 | 2 |
| 2009 | 1 | 1 |
| 2010 | 0 | 0 |
| 2011 | 1 | 0 |
| 2012 | 1 | 4 |
| 2013 | 2 | 2 |
| 2014 | 1 | 2 |
| 2015 | 1 | 2 |
| 2016 | 0 | 3 |
| 2017 | 1 | 4 |
| 2018 | 4 | 3 |
| 2019 | 1 | 1 |
| 2020 | 3 | 4 |
| 2021 | 2 | 3 |
| 2022 | 0 | 0 |
| 2023 | 2 | 1 |
| 2024 | 3 | 0 |
| 2025 | 0 | 1 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Polycarbosilazane, and composition comprising the same, and method for producing silicon-containing film using the same9 Jan 2024US 11,866,554 B2Merck Patent GmbH
- Gas barrier laminated body, method for producing same, member for electronic device, and electronic device19 Sep 2023US 11,760,854 B2Lintec Corporation
- Film with void spaces bonded through catalysis and method of producing the same4 Apr 2023US 11,618,807 B2Nitto Denko Corporation
- Methods for polymer materials17 Sep 2026US 2026/0275060 A1Qinetiq Limited
- Thermoplastic resin and molded object including thermoplastic resin5 Mar 2026US 2026/0062520 A1Mitsubishi Gas Chemical Company, Inc.
- New low-k materials derived by hydrosilylation and methods of using them for deposition22 May 2025US 2025/0161976 A1L Air Liquide, Societe Anonyme Pour L'Etude et L'Exploitation des Procedes Georges Claude
- Polycarbosilazane, and composition comprising the same, and method for producing silicon-containing film using the same28 Sep 2023US 2023/0303775 A1Merck Patent GmbH
- Resin composition, prepreg for printed circuit and metal-coated laminate30 Dec 2021US 2021/0403659 A1Shengyi Technology Co., Ltd.
Most cited
By later US patents
- Method for manufacturing porous structure and method for forming pattern645US 6,565,763 B1Kabushiki Kaisha Toshiba · 2003
- Method for manufacturing porous structure and method for forming pattern75US 7,090,784 B2Kabushiki Kaisha Toshiba · 2006
- Method for manufacturing porous structure and method for forming pattern36US 7,097,781 B2Kabushiki Kaisha Toshiba · 2006
- Method for manufacturing porous structure and method for forming pattern27US 7,517,466 B2Kabushiki Kaisha Toshiba · 2009
- Method for manufacturing porous structure and method for forming pattern20US 8,043,520 B2Kabushiki Kaisha Toshiba · 2011