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US 11,970,591 B2Granted
Resin composition, prepreg for printed circuit and metal-coated laminate
AssigneeShengyi Technology Co., Ltd.
InventorsYundong Meng, Kehong Fang
Life of this patent
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Abstract
Provided is a resin composition, a prepreg for a printed circuit and a metal-coated laminate. The resin composition includes: a silicone aryne resin, a polyphenylene ether resin with unsaturated bonds, and a butadiene polymer. The resin composition is used such that the prepared metal-coated laminate can have at least one of the following characteristics: a low dielectric loss factor, high heat resistance, and a low coefficient of thermal expansion.
Claims19
A resin composition, comprising:
- a silicon-containing arylacetylene resin,
- a polyphenylene ether resin with unsaturated bonds;
- and
- a butadiene polymer;
- wherein the silicon-containing arylacetylene resin, the polyphenylene ether resin with unsaturated bonds and the butadiene polymer have a weight ratio of (1-95):(5-70):(5-70);
- wherein the silicon-containing arylacetylene resin is represented by the following formula:
- wherein
- n is an integer between 1 and 5;
- and
- R1 and R2 are each independently a group selected from the group consisting of hydrogen, C1-6 alkyl or C3-6 cycloalkyl.
7 more elements
Dependencies are inferred from the claim text.