Back to results
US 2021/0403659 A1Published application
Resin composition, prepreg for printed circuit and metal-coated laminate
AssigneeShengyi Technology Co., Ltd.
InventorsYundong MENG, Kehong FANG
Life of this patent
Estimating the term…
Abstract
Provided is a resin composition, a prepreg for a printed circuit and a metal-coated laminate. The resin composition includes: a silicone aryne resin, a polyphenylene ether resin with unsaturated bonds, and a butadiene polymer. The resin composition is used such that the prepared metal-coated laminate can have at least one of the following characteristics: a low dielectric loss factor, high heat resistance, and a low coefficient of thermal expansion.
Claims20
A resin composition, comprising:
- a silicon-containing arylacetylene resin,
- a polyphenylene ether resin with unsaturated bonds;
- and
- a butadiene polymer;
- wherein the silicon-containing arylacetylene resin, the polyphenylene ether resin with unsaturated bonds and the butadiene polymer have a weight ratio of (1-95):(5-70):(5-70).
2 more elements
(canceled)
(canceled)
Dependencies are inferred from the claim text.