C08G 73/1014
In the form of anhydrid
Official title: {in the form of (mono)anhydrid}
C08G73/1014 (In the form of anhydrid) appears on 207 US grants and 189 published applications in this corpus.
Search patents in C08G- Granted patents
- 207
- Published applications
- 189
- Assignees
- 110
- Inventors
- 536
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 5 | 0 |
| 1991 | 12 | 0 |
| 1992 | 14 | 0 |
| 1993 | 8 | 0 |
| 1994 | 11 | 0 |
| 1995 | 9 | 0 |
| 1996 | 10 | 0 |
| 1997 | 4 | 0 |
| 1998 | 6 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 5 | 1 |
| 2002 | 5 | 2 |
| 2003 | 2 | 3 |
| 2004 | 2 | 2 |
| 2005 | 3 | 3 |
| 2006 | 2 | 2 |
| 2007 | 2 | 7 |
| 2008 | 2 | 6 |
| 2009 | 2 | 1 |
| 2010 | 2 | 6 |
| 2011 | 4 | 5 |
| 2012 | 2 | 3 |
| 2013 | 4 | 5 |
| 2014 | 5 | 7 |
| 2015 | 1 | 4 |
| 2016 | 5 | 11 |
| 2017 | 9 | 6 |
| 2018 | 3 | 6 |
| 2019 | 5 | 17 |
| 2020 | 4 | 16 |
| 2021 | 9 | 13 |
| 2022 | 9 | 16 |
| 2023 | 4 | 8 |
| 2024 | 14 | 14 |
| 2025 | 6 | 17 |
| 2026 | 4 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- UV-curable resin compositions suitable for redistribution layers25 Aug 2026US 12,717,232 B2Designer Molecules, Inc.
- Unsaturated cyclic anhydride end capped polyimides and polyamic acids and photosensitive compositions thereof2 Jun 2026US 12,643,981 B2Promerus, LLC
- Laminate and manufacturing method of semiconductor device27 Jan 2026US 12,534,399 B2Toray Industries, Inc.
- System and method for manufacturing polyamic acid, and system and method for manufacturing polyimide27 Jan 2026US 12,534,574 B2Kaneka Corporation
- Adhesive composition, adhesive tape, and method for processing electronic component30 Dec 2025US 12,509,612 B2Sekisui Chemical Co., Ltd.
- Curable resin composition23 Jul 2026US 2026/0209565 A1Shin-Etsu Chemical Co., Ltd.
- Soluble polymer compound, method for producing soluble polymer compound, resin composition, resin composition film, cured film, and electronic component23 Jul 2026US 2026/0211329 A1Toray Industries, Inc.
- Melamine-containing co-polyimide membranes for natural gas separation9 Jul 2026US 2026/0193413 A1Saudi Arabian Oil Company
- Curable resin composition for solder resist use18 Jun 2026US 2026/0166660 A1Shin-Etsu Chemical Co., Ltd.
- Photosensitive composition, cured product, electronic component, and method for producing cured product19 Mar 2026US 2026/0079397 A1Toray Industries, Inc.
Most cited
By later US patents
- Method for making polyimide oligomers48US 4,684,714 AThe Boeing Company · 1987
- Melt-processible semicrystalline block copolyimides47US 6,444,783 B1E. I. Du Pont de Nemours and Company · 2002
- Self-sealing injection reservoir42US 4,798,584 AMcGhan Medical Corporation · 1989
- Imide oligomers endcapped with phenylethynyl phthalic anhydrides and polymers therefrom35US 5,567,800 AThe United States of America as represented by the Administrator of the National Aeronautics and Space Administration · 1996
- Polyimide oligomers and blends and method of curing34US 5,116,935 AThe Boeing Company · 1992