Photosensitive composition, cured product, electronic component, and method for producing cured product

A photosensitive composition satisfying one or more selected from the group consisting of the following conditions (α), (β), and (γ), and comprising a binder resin (A) and a photosensitizer (C) and further comprising a radical polymerizable compound (B) and/or a cross-linking agent (F), wherein

• the binder resin (A) contains the following resin (A1) and/or resin (A2):
• resin (A1):
• a resin that contains, in structural units in a resin main chain, one or more selected from the group consisting of an imide structure, an amide structure, an oxazole structure, and a siloxane structure;
• resin (A2):
• a resin having a phenolic hydroxyl group in the structural units in the resin main chain;
• and
• (α) one or more selected from the group consisting of sulfonic acids, phosphate esters, phosphonic acids, phosphonate esters, phosphite esters, phosphinic acids, hypophosphite esters, and carboxylic acids containing a fluorine element is/are further contained, and the following condition (1x) is satisfied:
• (1x) a total content of the sulfonic acids, the phosphate esters, the phosphonic acids, the phosphonate esters, the phosphite esters, the phosphinic acids, the hypophosphite esters, and the carboxylic acids containing a fluorine element in the total solid content of the photosensitive composition is 0.010 to 1,000 ppm by mass;
• (β) one or more selected from the group consisting of a chloride ion, a bromide ion, a sulfate ion, a sulfite ion, a nitrate ion, a nitrite ion, a phosphate ion, a phosphite ion, a hypophosphite ion, a formate ion, and a fluoride ion is/are contained, and the following condition (2x) is satisfied:
• (2x) a total content of the chloride ion, the bromide ion, the sulfate ion, the sulfite ion, the nitrate ion, the nitrite ion, the phosphate ion, the phosphite ion, the hypophosphite ion, the formate ion, and the fluoride ion in the total solid content of the photosensitive composition is 0.010 to 1,000 ppm by mass;
• and
• (γ) one or more selected from the group consisting of benzene, toluene, xylene, and naphthalene is/are contained, and the following condition (3) is satisfied:
• (3) a total content of the benzene, the toluene, the xylene, and the naphthalene in the photosensitive composition is 0.010 to 1,000 ppm by mass.

An electronic component comprising a cured product, wherein

• the cured product contains the following resin (XA1) and/or resin (XA2) and satisfies the following condition (Xα):
• resin (XA1):
• a resin that contains, in structural units in a resin main chain, one or more selected from the group consisting of an imide structure, an amide structure, an oxazole structure, and a siloxane structure;
• resin (XA2):
• a resin having a phenolic hydroxyl group in the structural units in the resin main chain;
• and
• (Xα) one or more selected from the group consisting of sulfonic acids, phosphate esters, phosphonic acids, phosphonate esters, phosphite esters, phosphinic acids, hypophosphite esters, and carboxylic acids containing a fluorine element is/are further contained, and the following condition (X1x) is satisfied:
• (X1x) a total content of the sulfonic acids, the phosphate esters, the phosphonic acids, the phosphonate esters, the phosphite esters, the phosphinic acids, the hypophosphite esters, and the carboxylic acids containing a fluorine element in the cured product is 0.010 to 1,000 ppm by mass.