C08G 59/621
Phenols
Official title: {Phenols}
C08G59/621 (Phenols) appears on 782 US grants and 948 published applications in this corpus.
Search patents in C08G- Granted patents
- 782
- Published applications
- 948
- Assignees
- 364
- Inventors
- 2,210
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 3 | 0 |
| 1978 | 9 | 0 |
| 1979 | 5 | 0 |
| 1980 | 8 | 0 |
| 1981 | 11 | 0 |
| 1982 | 6 | 0 |
| 1983 | 12 | 0 |
| 1984 | 7 | 0 |
| 1985 | 10 | 0 |
| 1986 | 14 | 0 |
| 1987 | 20 | 0 |
| 1988 | 11 | 0 |
| 1989 | 15 | 0 |
| 1990 | 12 | 0 |
| 1991 | 12 | 0 |
| 1992 | 15 | 0 |
| 1993 | 12 | 0 |
| 1994 | 7 | 0 |
| 1995 | 9 | 0 |
| 1996 | 7 | 0 |
| 1997 | 10 | 0 |
| 1998 | 8 | 0 |
| 1999 | 4 | 0 |
| 2000 | 3 | 0 |
| 2001 | 10 | 2 |
| 2002 | 8 | 8 |
| 2003 | 14 | 14 |
| 2004 | 10 | 20 |
| 2005 | 8 | 10 |
| 2006 | 6 | 23 |
| 2007 | 6 | 36 |
| 2008 | 8 | 21 |
| 2009 | 13 | 36 |
| 2010 | 19 | 52 |
| 2011 | 27 | 38 |
| 2012 | 24 | 52 |
| 2013 | 28 | 45 |
| 2014 | 28 | 37 |
| 2015 | 29 | 37 |
| 2016 | 30 | 53 |
| 2017 | 28 | 47 |
| 2018 | 39 | 34 |
| 2019 | 31 | 43 |
| 2020 | 35 | 40 |
| 2021 | 26 | 42 |
| 2022 | 26 | 57 |
| 2023 | 30 | 38 |
| 2024 | 19 | 48 |
| 2025 | 33 | 61 |
| 2026 | 13 | 54 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Aromatic diol compounds, diepoxide compounds, polymers prepared from such compounds, and methods for making the same1 Sep 2026US 12,723,128 B2Swimc LLC
- Method for producing product, adhesive composition and foaming adhesive sheet11 Aug 2026US 12,703,809 B2Dai Nippon Printing Co.Ltd.
- Epoxy resin composition, cured product, and electrical/electronic component28 Jul 2026US 12,692,342 B2Mitsubishi Chemical Corporation
- Epoxy resin composition with epoxy groups and active hydrogens having different molar equivalents16 Jun 2026US 12,655,288 B2Bamstone New Material Technology (Wuhan) Co., Ltd.
- Liquid compression molding material19 May 2026US 12,630,668 B2Namics Corporation
- Epoxy resin composition particle, tablet, and method for producing columnar tablet1 Oct 2026US 2026/0297243 A1Sumitomo Bakelite Co., Ltd.
- Syntactic foam compositions1 Oct 2026US 2026/0297388 A1PRC-DeSoto International, Inc.
- Conductive composition17 Sep 2026US 2026/0275026 A1Tatsuta Electric Wire & Cable Co., Ltd.
- Structural Adhesives Cured By Polycarbonate10 Sep 2026US 2026/0265591 A1Zephyros, Inc.
- Easily dismantlable resin composition for fixing rotor and dismantling method for rotor27 Aug 2026US 2026/0250479 A1Sumitomo Bakelite Co., Ltd.
Most cited
By later US patents
- Process for reacting a phenol with a vicinal epoxy compound in the presence of phosphorus or carbon containing acid, ester or acid ester77US 3,948,855 AThe Dow Chemical Company · 1976
- Epoxy resin composition, and adhesive film and prepreg using the composition, and multilayer printed-wiring board using them, and process for manufacturing the same72US 6,403,221 B1Ajinomoto Co., Inc. · 2002
- Amide and hydroxymethyl functionalized polyethers as thermoplastic barrier resins71US 5,115,075 AThe Dow Chemical Company · 1992
- Arylamine containing polyhydroxy ether resins and system utilizing arylamine containing polyhydroxyl ether resins66US 4,818,650 AXerox Corporation · 1989
- Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor65US 8,411,415 B2Air Water Inc. · 2013