Conductive composition

A conductive composition comprising an epoxy compound, an imidazole compound, a phenolic curing agent and conductive particles,

• wherein in the epoxy compound, a content percentage of a naphthalene skeleton-containing epoxy resin is 10 to 30% by mass, a content percentage of a glycidylamine-based epoxy resin is 40 to 90% by mass, and a content percentage of a reactive diluent having one to two glycidylether functional groups in an aliphatic hydrocarbon chain is 10% by mass or less,
• the imidazole compound contains at least one selected from the group consisting of 2-undecylimidazole, 2-heptadecylimidazole, 4-methyl-2-phenylimidazole and 2-phenyl-4-methyl-5-hydroxymethylimidazole,
• a content of the imidazole compound is three to 10 parts by mass based on 100 parts by mass of the epoxy compound,
• a content of the phenolic curing agent is 10 to 20 parts by mass based on 100 parts by mass of the epoxy compound, and
• a content of the conductive particles is 82 to 90% by mass in the conductive composition.