Epoxy resin composition with epoxy groups and active hydrogens having different molar equivalents
AssigneeBamstone New Material Technology (Wuhan) Co., Ltd.
InventorWei Liu
Life of this patent
Estimating the term…
Loading patent…
AssigneeBamstone New Material Technology (Wuhan) Co., Ltd.
InventorWei Liu
Estimating the term…
An epoxy resin composition with epoxy groups and active hydrogens having different molar equivalents includes an epoxy resin component and a curing agent component. A mixing ratio of the epoxy resin component and the curing agent component is a mixing ratio of a cured product with the highest glass transition temperature Tg among cured products with different mixing ratios measured experimentally. According to a weight percentage in a total weight of the epoxy resin component, the epoxy resin component includes: 50 wt % to 100 wt % of a bisphenol A epoxy resin. According to a weight percentage in a total weight of the curing agent component, the curing agent component includes: 60 wt % to 98 wt % of polyetheramine (PEA) and 2 wt % to 20 wt % of a low-viscosity Mannich base.
An epoxy resin composition with epoxy groups and active hydrogens having different molar equivalents, comprising an epoxy resin component and a curing agent component, wherein a mixing ratio of the epoxy resin component and the curing agent component is not a theoretical value calculated based on an epoxy equivalent and an active hydrogen equivalent, and the mixing ratio of the epoxy resin component and the curing agent component is a mixing ratio of a cured product with a maximum glass transition temperature Tg among cured products with different mixing ratios measured experimentally;
Dependencies are inferred from the claim text.