Back to results
US 12,630,668 B2Granted
Liquid compression molding material
AssigneeNamics Corporation
InventorsMakoto Suzuki, Tsuyoshi Kamimura, Yosuke Sakai
Life of this patent
Estimating the term…
Abstract
A method for producing a semiconductor element by wafer-level chip-size packaging includes applying a liquid compression molding material to a wafer after completion of circuit formation and subjecting the wafer to sealing treatment by compression molding. The liquid compression molding material includes (A) an epoxy resin; (B) a curing agent; and (C) a filler. The liquid compression molding material having a thixotropic index (TI) of 0.8 to 4.0.
Claims8
A method for producing a semiconductor element by wafer-level chip-size packaging, the method comprising:
- applying a liquid compression molding material to a wafer after completion of circuit formation;
- and
- subjecting the wafer to sealing treatment by compression molding,
- wherein the liquid compression molding material comprises (A) an epoxy resin, (B) a curing agent, and (C) a filler,
- wherein the liquid compression molding material has a thixotropic index (TI) of 0.8 to 4.0, and
- wherein component (C) contains silica particles with a particle size of 50 nm to 100 nm and silica particles having an average particles size of 0.6 to 2 μm, the content of the silica particles with a particle size of 50 nm to 100 nm being 8 to 19 wt. % based on the total weight of component (C).
3 more elements
Dependencies are inferred from the claim text.