Epoxy resin composition, cured product, and electrical/electronic component
AssigneeMitsubishi Chemical Corporation
InventorKazumasa Ota
Life of this patent
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Abstract
An epoxy resin composition (A), having an epoxy resin represented by formula (1): and an epoxy resin represented by formula (2): where R1 is a linear aliphatic hydrocarbon group having 1 to 6 carbon atoms, and n is an integer of 0 or 1. An epoxy resin composition (B), having 100 parts by weight of the epoxy resin composition (A) and 0.01 to 1,000 parts by weight of a curing agent.
Claims8
An epoxy resin composition (A), comprising an epoxy resin of formula (1) and an epoxy resin of formula (2):
- wherein R1 is a linear aliphatic hydrocarbon group having from 4 to 6 carbon atoms, and
- n is an integer of 0 or 1,
- wherein a hydrolyzable chlorine content of the epoxy resin composition (A) is 300 ppm or less by weight.
An epoxy resin composition (B), comprising 100 parts by weight of the epoxy resin composition (A) according to claim 1 and 0.01 to 1,000 parts by weight of a curing agent.
Dependencies are inferred from the claim text.