C08G 59/38
Together with di-epoxy compounds
Official title: together with di-epoxy compounds
C08G59/38 (Together with di-epoxy compounds) appears on 482 US grants and 408 published applications in this corpus.
Search patents in C08G- Granted patents
- 482
- Published applications
- 408
- Assignees
- 270
- Inventors
- 1,344
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 2 | 0 |
| 1978 | 5 | 0 |
| 1979 | 3 | 0 |
| 1980 | 5 | 0 |
| 1981 | 1 | 0 |
| 1982 | 5 | 0 |
| 1983 | 3 | 0 |
| 1984 | 10 | 0 |
| 1985 | 15 | 0 |
| 1986 | 12 | 0 |
| 1987 | 8 | 0 |
| 1988 | 17 | 0 |
| 1989 | 13 | 0 |
| 1990 | 12 | 0 |
| 1991 | 13 | 0 |
| 1992 | 14 | 0 |
| 1993 | 10 | 0 |
| 1994 | 14 | 0 |
| 1995 | 15 | 0 |
| 1996 | 9 | 0 |
| 1997 | 10 | 0 |
| 1998 | 10 | 0 |
| 1999 | 8 | 0 |
| 2000 | 7 | 0 |
| 2001 | 12 | 4 |
| 2002 | 11 | 10 |
| 2003 | 10 | 17 |
| 2004 | 13 | 6 |
| 2005 | 5 | 9 |
| 2006 | 4 | 7 |
| 2007 | 4 | 8 |
| 2008 | 0 | 10 |
| 2009 | 3 | 12 |
| 2010 | 7 | 19 |
| 2011 | 10 | 18 |
| 2012 | 8 | 14 |
| 2013 | 7 | 18 |
| 2014 | 15 | 10 |
| 2015 | 10 | 18 |
| 2016 | 12 | 16 |
| 2017 | 11 | 17 |
| 2018 | 10 | 16 |
| 2019 | 18 | 21 |
| 2020 | 15 | 17 |
| 2021 | 13 | 34 |
| 2022 | 14 | 17 |
| 2023 | 10 | 15 |
| 2024 | 12 | 25 |
| 2025 | 16 | 25 |
| 2026 | 6 | 25 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Curable resin film, film material for semiconductor device production, curable resin composition for semiconductor device production, and method for producing semiconductor device4 Aug 2026US 12,702,047 B2
- Bonding method16 Jun 2026US 12,655,333 B2Nitto Denko Corporation
- Composition2 Jun 2026US 12,644,031 B2Kansai Helios Austria GmbH
- Curable adhesive, bonding film, and method of bonding the same7 Apr 2026US 12,595,333 B23M Innovative Properties Company
- Pultrusion with extruded gasket foam13 Jan 2026US 12,522,688 B2Zephyros, Inc.
- Resin Composition and Use Thereof8 Oct 2026US 2026/0308375 A1Tokuyama Corporation
- Prepreg, fiber-reinforced composite material, tubular body made of fiber-reinforced composite material, golf club shaft, and fishing rod27 Aug 2026US 2026/0250459 A1Toray Industries, Inc.
- Curable Resin Composition and Adhesive Composition27 Aug 2026US 2026/0250504 A1Kuk Do Chemical Co., Ltd.
- Two-Part High Percentage Bio-Based Polymeric Compositions27 Aug 2026US 2026/0250563 A1
- Epoxy-based uv-vis-curable encapsulant compositions13 Aug 2026US 2026/0234322 A1Sicpa Holding SA
Most cited
By later US patents
- Composition for photo imaging77US 5,439,766 AInternational Business Machines Corporation · 1995
- Epoxy resin composition with cycloaliphatic epoxy-functional siloxane66US 5,863,970 AMotorola, Inc. · 1999
- Manufacture of void-free laminates and use thereof66US 6,391,436 B1Cytec Technology Corp. · 2002
- Thermosetting resin composition, electrically insulated coil, electric rotating machine and method for producing same52US 5,982,056 AHitachi, Ltd. · 1999
- High performance induction curable two-component structural adhesive with nonsagging behavior51US 4,762,864 AAshland Oil, Inc. · 1988