Resin Composition and Use Thereof

Abstract

The present invention relates to providing a resin composition which has high fluidity and provides a cured product having low linear expansivity and high thermal conduction property. A first resin composition of the present invention contains an epoxy resin (A), an aluminum nitride filler (B), and an alumina filler (C), in which a total amount of the aluminum nitride filler (B) and the alumina filler (C) is 800 to 1800 parts by mass with respect to 100 parts by mass of the epoxy resin (A). The epoxy resin (A) contains a solid epoxy resin (A-1) and a liquid epoxy resin (A-2), the aluminum nitride filler (B) has an average particle diameter D50 of 0.2 to 3 μm and a maximum particle diameter Dmax of 5 μm or less, and the alumina filler (C) has an average particle diameter D50 of 0.05 to 1.5 μm.

Dependencies are inferred from the claim text.