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US 12,595,333 B2Granted
Curable adhesive, bonding film, and method of bonding the same
Assignee3M Innovative Properties Company
InventorsLianzhou Chen, Kristen J. Hansen
Life of this patent
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Abstract
A curable composition comprises: 1 to 65 percent by weight of polyepoxide comprising an addition reaction product of phenolphthalein and bisphenol A diglycidyl ether; 5 to 50 percent by weight of liquid polyepoxide; and an effective amount of curative for curing the curable composition. A curable adhesive film comprising the curable composition, and method of bonding are also disclosed.
Claims15
A curable composition comprising, based on the total weight of the curable composition, components:
- a) 1 to 65 percent by weight of polyepoxide comprising an addition reaction product of phenolphthalein and bisphenol A diglycidyl ether, wherein the addition reaction product of phenolphthalein and bisphenol A diglycidyl ether comprises a compound having the structural formula;
- and
- b) 5 to 50 percent by weight of liquid polyepoxide, wherein the liquid polyepoxide is exclusive of component a);
- and
- c) an effective amount of curative for curing the curable composition.
2 more elements
Dependencies are inferred from the claim text.