C08G 59/32
Epoxy compounds containing three or more epoxy groups
C08G59/32 (Epoxy compounds containing three or more epoxy groups) appears on 1,565 US grants and 1,410 published applications in this corpus.
Search patents in C08G- Granted patents
- 1,565
- Published applications
- 1,410
- Assignees
- 647
- Inventors
- 3,783
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 19 | 0 |
| 1977 | 16 | 0 |
| 1978 | 11 | 0 |
| 1979 | 4 | 0 |
| 1980 | 16 | 0 |
| 1981 | 8 | 0 |
| 1982 | 9 | 0 |
| 1983 | 14 | 0 |
| 1984 | 20 | 0 |
| 1985 | 28 | 0 |
| 1986 | 23 | 0 |
| 1987 | 29 | 0 |
| 1988 | 38 | 0 |
| 1989 | 33 | 0 |
| 1990 | 33 | 0 |
| 1991 | 35 | 0 |
| 1992 | 52 | 0 |
| 1993 | 47 | 0 |
| 1994 | 46 | 0 |
| 1995 | 35 | 0 |
| 1996 | 19 | 0 |
| 1997 | 34 | 0 |
| 1998 | 28 | 0 |
| 1999 | 28 | 0 |
| 2000 | 23 | 0 |
| 2001 | 37 | 8 |
| 2002 | 34 | 30 |
| 2003 | 32 | 47 |
| 2004 | 31 | 40 |
| 2005 | 21 | 32 |
| 2006 | 21 | 39 |
| 2007 | 19 | 45 |
| 2008 | 14 | 38 |
| 2009 | 11 | 35 |
| 2010 | 23 | 69 |
| 2011 | 40 | 57 |
| 2012 | 32 | 48 |
| 2013 | 32 | 52 |
| 2014 | 37 | 52 |
| 2015 | 40 | 71 |
| 2016 | 40 | 60 |
| 2017 | 36 | 61 |
| 2018 | 45 | 63 |
| 2019 | 54 | 66 |
| 2020 | 57 | 72 |
| 2021 | 49 | 95 |
| 2022 | 49 | 84 |
| 2023 | 47 | 62 |
| 2024 | 50 | 67 |
| 2025 | 41 | 56 |
| 2026 | 25 | 61 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- C08G 59/38Together with di-epoxy compounds482
- C08G 59/3218Carbocyclic compounds390
- C08G 59/3254Containing atoms other than carbon, hydrogen, oxygen or nitrogen319
- C08G 59/3227Compounds containing acyclic nitrogen atoms149
- C08G 59/3236Heterocylic compounds135
- C08G 59/3209Obtained by polymerisation of unsaturated mono-epoxy compounds84
- C08G 59/36Together with mono-epoxy compounds48
- C08G 59/34Obtained by epoxidation of an unsaturated polymer22
Recent patents
- Cationic epoxy compositions4 Aug 2026US 12,698,359 B2Henkel AG & Co. KGaA
- Direct write dual cure gasket4 Aug 2026US 12,698,410 B2Raytheon Company
- Curable resin film, film material for semiconductor device production, curable resin composition for semiconductor device production, and method for producing semiconductor device4 Aug 2026US 12,702,047 B2
- Curable composition28 Jul 2026US 12,692,341 B2Daicel Corporation
- Epoxy resin16 Jun 2026US 12,655,248 B2Commonwealth Scientific and Industrial Research Organisation
- Resin Composition and Use Thereof8 Oct 2026US 2026/0308375 A1Tokuyama Corporation
- Epoxy resin composition particle, tablet, and method for producing columnar tablet1 Oct 2026US 2026/0297243 A1Sumitomo Bakelite Co., Ltd.
- Phosphonate epoxy thermosets27 Aug 2026US 2026/0250458 A1
- Prepreg, fiber-reinforced composite material, tubular body made of fiber-reinforced composite material, golf club shaft, and fishing rod27 Aug 2026US 2026/0250459 A1Toray Industries, Inc.
- Easily dismantlable resin composition, structural body including cured product of easily dismantlable resin composition, dismantling method for structural body, and recycling method for material constituting structural body27 Aug 2026US 2026/0250481 A1Sumitomo Bakelite Co., Ltd.
Most cited
By later US patents
- Crosslinkable compositions containing polyepoxides and polyacid curing agents109US 4,764,430 APPG Industries, Inc. · 1988
- Epoxy resin curing agent, process, and composition96US 4,684,678 AMinnesota Mining and Manufacturing Company · 1987
- Composition comprising silicone epoxy resin, hydroxyl compound, anhydride and curing catalyst82US 6,632,892 B2General Electric Company · 2003
- Composition for photo imaging77US 5,439,766 AInternational Business Machines Corporation · 1995
- Methods and compositions related to stereolithography67US 5,639,413 A1997