Composition comprising silicone epoxy resin, hydroxyl compound, anhydride and curing catalyst
AssigneeGeneral Electric Company
InventorsMalgorzata Iwona Rubinsztajn, Slawomir Rubinsztajn
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Abstract
Epoxy resin compositions are disclosed which comprise (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride curing agent, (D) at least one ancillary curing catalyst, and optionally at least one of thermal stabilizers, UV stabilizers, cure modifiers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.
Claims23
A curable epoxy resin composition for encapsulation of a solid state device, which comprises (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound. (C) at least one anhydride curing agent, and (D) at least one ancillary curing catalyst, wherein component (A) is present at a level of greater than about 40% by weight;
- component (B) is present at a level in a range of between about 1% by weight and about 20% by weight;
- component (C) is present at a level of less than about 25% by weight;
- and component (D) is present at a level in a range between about 0.008% by weight and about 10% by weight based on the combined weight of silicone epoxy resin (A), hydroxyl-containing compound (B), curing agent (C), and ancillary curing catalyst (D).
A curable epoxy resin composition for encapsulation of a solid state device, which comprises (A) a silicone epoxy resin comprising 1,1,3,3-tetramethyl-1,3-bis[2(7-oxabicyclo[4.1.0]hept-3-yl)ethyl]disiloxane, (B) a hydroxyl-containing silicone resin comprising the hydrolysis product of a mixture of phenyltrichlorosilane, methyltrichlorosilane, and dimethyldichlorosilane, (C) a curing catalyst comprising hexahydro-4-methylphthalic anhydride, and (D) zinc octoate, wherein component (A) is present at a level of greater than about 40% by weight;
- component (B) is present at a level in a range of between about 1% by weight and about 20% by weight;
- component (C) is present at a level of less than about 25% by weight;
- and component (D) is present at a level in a range between about 0.008% by weight and about 10% by weight based on the combined weight of silicone epoxy resin (A), hydroxyl-containing compound (B), curing agent (C), and ancillary curing catalyst (D).
Dependencies are inferred from the claim text.