Easily dismantlable resin composition, structural body including cured product of easily dismantlable resin composition, dismantling method for structural body, and recycling method for material constituting structural body

Abstract

An easily dismantlable resin composition according to the present invention contains a thermosetting resin, and an adhesion strength ratio (S2/S1) measured by the following procedure is 0.30 or less. [Procedure] The easily dismantlable resin composition is molded over a copper substrate under conditions of 175° C., 6.9 MPa, and 120 seconds and then subjected to post-curing at 175° C. for 4 hours to obtain a test piece. An adhesion strength [N/mm2], which is obtained in a case where shearing adhesiveness to the copper substrate is measured at a rate of 300 μm/second at room temperature by using the test piece, is denoted as S1 [N/mm2]. Further, an adhesion strength [N/mm2] which is obtained in a case where the test piece is heated at 300° C. for 30 minutes and then shearing adhesiveness to the copper substrate is measured at a rate of 300 μm/second at room temperature is denoted as S2 [N/mm2].

Dependencies are inferred from the claim text.