C08G 59/3236
Heterocylic compounds
Official title: {Heterocylic compounds}
C08G59/3236 (Heterocylic compounds) appears on 135 US grants and 132 published applications in this corpus.
Search patents in C08G- Granted patents
- 135
- Published applications
- 132
- Assignees
- 88
- Inventors
- 341
- Latest grant
- 10 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 5 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 6 | 0 |
| 1986 | 4 | 0 |
| 1987 | 5 | 0 |
| 1988 | 0 | 0 |
| 1989 | 4 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 3 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 1 |
| 2002 | 0 | 2 |
| 2003 | 3 | 3 |
| 2004 | 1 | 5 |
| 2005 | 2 | 2 |
| 2006 | 2 | 2 |
| 2007 | 0 | 2 |
| 2008 | 0 | 4 |
| 2009 | 1 | 1 |
| 2010 | 2 | 12 |
| 2011 | 1 | 9 |
| 2012 | 7 | 4 |
| 2013 | 5 | 7 |
| 2014 | 6 | 5 |
| 2015 | 7 | 6 |
| 2016 | 2 | 7 |
| 2017 | 2 | 4 |
| 2018 | 3 | 11 |
| 2019 | 10 | 12 |
| 2020 | 11 | 6 |
| 2021 | 4 | 3 |
| 2022 | 3 | 9 |
| 2023 | 3 | 4 |
| 2024 | 4 | 4 |
| 2025 | 3 | 3 |
| 2026 | 2 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Resist underlying film-forming composition comprising a reaction product with a glycidyl ester compound10 Mar 2026US 12,572,074 B2Nissan Chemical Corporation
- Resin composition, resin composition film, cured film, hollow structure using same, and semiconductor device10 Feb 2026US 12,545,784 B2Toray Industries, Inc.
- Photosensitive resin composition, photosensitive dry film, and pattern formation method9 Dec 2025US 12,493,244 B2Shin-Etsu Chemical Co., Ltd.
- Curable resin system2 Sep 2025US 12,404,362 B2Huntsman Advanced Materials Americas LLC
- Curable resin composition13 May 2025US 12,297,318 B2Canon Kabushiki Kaisha
- Curable Resin Composition and Adhesive Composition27 Aug 2026US 2026/0250504 A1Kuk Do Chemical Co., Ltd.
- Prepreg and fiber-reinforced plastic4 Jun 2026US 2026/0152611 A1Mitsubishi Chemical Corporation
- Curable resin composition and cured product thereof30 Apr 2026US 2026/0117017 A1Nippon Kayaku Kabushiki Kaisha
- Tape structure of a tape for use in manufacturing a composite structure, automated fiber placement (afp) device, automated fiber placement (afp) method and composite structure29 Jan 2026US 2026/0027786 A1
- Solvent-free thermosetting quantum dot resin composition, quantum dot resin composite prepared therefrom, and led package and display device employing same18 Sep 2025US 2025/0294930 A1Hansol Chemical Co., Ltd.
Most cited
By later US patents
- Light-emitting device, method for manufacturing same, molded body and sealing member48US 8,575,632 B2Nichia Corporation · 2013
- Hydroxy aromatic oligomers containing triazine and oxazoline groups and epoxy resins prepared therefrom23US 4,487,915 AThe Dow Chemical Company · 1984
- Polymer modified cyanate mixture and epoxy resins thereof22US 4,546,131 AThe Dow Chemical Company · 1985
- Imide functional polyphenols; thermosettable compositions containing same and cured products therefrom22US 4,555,563 AThe Dow Chemical Company · 1985
- Toughened fiber-reinforced composites22US 5,268,223 AAmoco Corporation · 1993