Curable resin composition and cured product thereof
AssigneeNippon Kayaku Kabushiki Kaisha
InventorsTakashi IMAI, Kiwamu TERADA, Masataka NAKANISHI, Hiroki KONDO
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Abstract
A curable resin composition has high biomass content and is exemplary in high heat resistance and low dielectric properties and a cured product of the curable resin composition. The curable resin composition includes an epoxy resin represented by the following formula (1) and an acid anhydride curing agent including a biomass-derived compound. (In formula (1), n is an average value of the number of repetitions and represents a real number where 1<n<15.)
Claims9
A curable resin composition, comprising an epoxy resin represented by the following formula (1) and a biomass-modified acid anhydride, wherein the biomass-modified acid anhydride is at least one selected from myrcene-modified acid anhydride, farnesene-modified acid anhydride, and α-terpinene-modified acid anhydride,
- (in formula (1), n is an average value of the number of repetitions and represents a real number where 1<n<15).
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Dependencies are inferred from the claim text.