C08F 222/404
Substituted imides comprising oxygen other than the carboxy oxygen
Official title: {substituted imides comprising oxygen other than the carboxy oxygen}
C08F222/404 (Substituted imides comprising oxygen other than the carboxy oxygen) appears on 114 US grants and 45 published applications in this corpus.
Search patents in C08F- Granted patents
- 114
- Published applications
- 45
- Assignees
- 58
- Inventors
- 234
- Latest grant
- 6 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 10 | 0 |
| 1990 | 9 | 0 |
| 1991 | 14 | 0 |
| 1992 | 11 | 0 |
| 1993 | 10 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 3 |
| 2010 | 0 | 1 |
| 2011 | 1 | 3 |
| 2012 | 2 | 2 |
| 2013 | 3 | 0 |
| 2014 | 3 | 5 |
| 2015 | 1 | 2 |
| 2016 | 2 | 3 |
| 2017 | 5 | 1 |
| 2018 | 2 | 6 |
| 2019 | 2 | 6 |
| 2020 | 4 | 2 |
| 2021 | 3 | 3 |
| 2022 | 1 | 1 |
| 2023 | 1 | 1 |
| 2024 | 3 | 4 |
| 2025 | 0 | 0 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Heat-curable maleimide resin composition for RTM, fiber-reinforced composite material and radome6 Jan 2026US 12,516,163 B2Shin-Etsu Chemical Co., Ltd.
- Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition22 Oct 2024US 12,122,129 B2Panasonic Intellectual Property Management Co., Ltd.
- Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device5 Mar 2024US 11,924,979 B2Mitsubishi Gas Chemical Company, Inc.
- Bismaleimide compound, composition containing same, polybenzoxazole, and semiconductor device20 Feb 2024US 11,905,356 B2Nippon Kayaku Kabushiki Kaisha
- Dual cure stereolithography resins containing thermoplastic particles18 Apr 2023US 11,629,202 B2Carbon, Inc.
- Material for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, patterning process, compound for forming organic film, and aromatic carboxylic anhydride9 Apr 2026US 2026/0101693 A1Shin-Etsu Chemical Co., Ltd.
- Active energy ray curable composition28 Nov 2024US 2024/0392049 A1Kj Chemicals Corporation
- Amine-substituted pyrrolidine-2,5-dionyl copolymers, polyimides, articles, and methods10 Oct 2024US 2024/0336739 A1Essex Furukawa Magnet Wire USA LLC
- Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device29 Aug 2024US 2024/0287347 A1Mitsubishi Gas Chemical Company, Inc.
- Positive photoresist resin composition and insulating film and display device based thereon4 Jan 2024US 2024/0004292 A1Dongjin Semichem Co., Ltd.
Most cited
By later US patents
- Crosslinkable polymers of unsaturated imides30US 4,189,560 ACiba-Geigy Corporation · 1980
- Photoresist compositions containing copolymers having acid-labile groups and recurring units derived from either N-(hydroxymethyl)maleimide or N-(acetoxymethyl)maleimide or both30US 5,558,978 AOCG Microelectronic Materials, Inc. · 1996
- Copolymer resin of maleimide and alicyclic olefin-based monomers, photoresist containing the copolymer resin and the preparation thereof27US 6,028,153 AHyundai Electronics Industries Co., Ltd. · 2000
- Crosslinkable polymers of unsaturated imides24US 4,187,364 ACiba-Geigy Corporation · 1980
- Curable resin from bis-maleimide and alkenyl phenyl hydroxy ether22US 4,871,821 ATechnochemie GmbH · 1989