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US 2024/0004292 A1Published application
Positive photoresist resin composition and insulating film and display device based thereon
AssigneeDongjin Semichem Co., Ltd.
InventorsTai Hoon YEO, Hyoc Min YOUN, Dong Myung KIM, Sun Hee LEE, Ah Rum PARK, Gun Seok JANG, Seok Hyun LEE, Nu Ri OH, In Ho SONG
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Abstract
A positive-type photosensitive resin composition, an insulating film made from the same, and a display device including such insulating film are provided. The positive photosensitive resin composition is excellent in sensitivity and has excellent chemical resistance, heat resistance, and hygroscopicity by including a polymer containing a hydroxyl group.
Claims20
A positive-type photosensitive resin composition comprising:
- a first polymer comprising one or more structures selected from the group consisting of polyamic acid ester, polyamic acid, and polyimide;
- a second polymer containing at least one hydroxyl group among repeating units;
- a photosensitizer;
- and
- a solvent,
- wherein a hydroxyl group equivalent ratio of the first polymer to the second polymer is 1:0.04 to 1:74.
3 more elements
Dependencies are inferred from the claim text.