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US 12,122,129 B2Granted
Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsHiroaki Umehara, Rihoko Watanabe, Hiroharu Inoue, Yiqun Wang
Life of this patent
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Abstract
One aspect of the present invention relates to a resin composition containing (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) at least one of maleimide compounds represented by the formulas (1) to (3).
Claims12
A resin composition comprising:
- (A) a thermosetting compound comprising
- at least one selected from the group consisting of divinylbenzene and derivatives of divinylbenzene;
- and
- a polyphenylene ether (PPE) compound having
- a styrene structure or
- a (meth) acrylate structure
- as a substituent at the molecular terminal;
- and
- (B) at least one of maleimide compounds represented by following formulas (1) to (3),
- wherein p represents an integer of 1 to 10,
- wherein q represents an integer of 1 to 10,
- wherein the content ratio of the component (A) to the component (B) is (A):(B)=20:80 to 80:20 in mass ratio.
9 more elements
Dependencies are inferred from the claim text.