Designer Molecules, Inc.
San Diego, CA, US· latest recorded location
Designer Molecules, Inc. is named on 36 US grants and 57 published applications in this corpus. Its most frequent classification is C09J (Adhesives).
- Granted patents
- 36
- Published applications
- 57
- Inventors
- 8
- Granted in 2026 so far
- 1
- Most recent grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2004 | 0 | 2 |
| 2005 | 0 | 1 |
| 2006 | 0 | 2 |
| 2007 | 3 | 3 |
| 2008 | 0 | 11 |
| 2009 | 0 | 3 |
| 2010 | 6 | 9 |
| 2011 | 10 | 4 |
| 2012 | 5 | 2 |
| 2013 | 6 | 8 |
| 2014 | 4 | 3 |
| 2015 | 0 | 1 |
| 2016 | 1 | 1 |
| 2017 | 0 | 0 |
| 2018 | 0 | 1 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 1 |
| 2022 | 0 | 3 |
| 2023 | 0 | 2 |
| 2024 | 0 | 0 |
| 2025 | 0 | 0 |
| 2026 | 1 | 0 |
By publication year. 2026 runs to 8 Oct.
Technology areas
Share of 93 documents
- C09JAdhesives62
- C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds48
- C07CAcyclic or carbocyclic compounds37
- C08LCompositions of macromolecular compounds31
- C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds27
- C07DHeterocyclic compounds25
- C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients25
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by24
- C09DCoating compositions17
- Y10TTechnical subjects covered by former us classification13
Recent patents
- UV-curable resin compositions suitable for redistribution layers25 Aug 2026US 12,717,232 B2
- Amide-extended crosslinking compounds and methods for use thereof8 Mar 2016US 9,278,909 B2
- Curable composition with rubber-like properties26 Aug 2014US 8,816,021 B2
- Materials and methods for stress reduction in semiconductor wafer passivation layers29 Apr 2014US 8,710,682 B2
- Maleimide-functional monomers in amorphous form1 Apr 2014US 8,686,162 B2
- Low dk copper clad laminate compositions11 May 2023US 2023/0143643 A1
- Uv-curable resin compositions suitable for redistribution layers30 Mar 2023US 2023/0095931 A1
- Extreme high temperature stable adhesives and coatings7 Jul 2022US 2022/0213267 A1
- Phenolic functionalized polyimides and compositions thereof30 Jun 2022US 2022/0204696 A1
- High molecular weight flexible curable polyimides30 Jun 2022US 2022/0204766 A1
Most cited
By later US patents
- Imide-linked maleimide and polymaleimide compounds38US 7,208,566 B22007
- Imide-extended liquid bismaleimide resin34US 7,157,587 B22007
- Free-radical curable polyesters and methods for use thereof30US 7,285,613 B22007
- Adhesive composition of phenol-functional polyamides30US 7,678,879 B22010
- Adhesive compositions containing cyclic siloxanes and methods for use thereof17US 7,777,064 B22010