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US 2022/0204766 A1Published application
High molecular weight flexible curable polyimides
AssigneeDesigner Molecules, Inc.
InventorsFarhad G Mizori, Eunsook Chae Barber
Life of this patent
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Abstract
Curable polyimides with very good dielectric properties have been prepared. These materials also are ideal for being transformed into flexible films that are ready to be laminated for example between copper foils for applications such as copper clad laminates.
Claims21
1-54. (canceled)
A high molecular weight, curable polyimide compound having a structure according to the following Formula I:
- wherein,
- R is selected from the group consisting of:
- substituted or unsubstituted aromatic, aliphatic, cycloaliphatic, alkenyl, polyether, polyester, polyamide, heteroaromatic, and siloxane, and combinations thereof;
- Q is selected from the group consisting of:
- substituted or unsubstituted aromatic, aliphatic, cycloaliphatic, alkenyl, polyether, polyester, polyamide, heteroaromatic, siloxane, and combinations thereof;
- X is a curable moiety, optionally selected from the group consisting of:
- maleimide, benzoxazine, citraconimide, itaconimide, methacrylamide, acrylamide, phenolic, free-amine, carboxylic acid, alcohol, acrylate, methacrylate, oxazoline, vinyl ether, vinyl ester, allylic, vinylic, anhydride, and combinations thereof;
- and
- n is 0 or an integer having the value from 1 to 100 or an integer having the value from 20-100;
- and with the proviso that, the average molecular weight of the material is greater than 20,000 Daltons or is 25,000 to 50,000 Daltons.
7 more elements
Dependencies are inferred from the claim text.