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US 7,678,879 B2Granted
Adhesive composition of phenol-functional polyamides
AssigneeDesigner Molecules, Inc.
InventorStephen M. Dershem
Life of this patent
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Abstract
The invention is based on the discovery that the compounds and compositions described herein are useful as film-forming adhesives for use in a variety of applications, including, for example, adhesive tapes for the electronic packaging industry. The invention compositions described herein can be cured in a variety of ways with or without a catalyst.
Claims4
A compound having the structure
- wherein:
- X and Y are 0 to about 25.
A compound having the structure:
- wherein:
- X and Y are 0 to about 25.
A compound having the structure:
- wherein:
- X and Y are 0 to about 25.
A compound having the structure:
Dependencies are inferred from the claim text.