C08F 22/40
Imides
Official title: Imides, e.g. cyclic imides
C08F22/40 (Imides) appears on 99 US grants and 80 published applications in this corpus.
Search patents in C08F- Granted patents
- 99
- Published applications
- 80
- Assignees
- 53
- Inventors
- 241
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 5 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 3 | 0 |
| 1986 | 6 | 0 |
| 1987 | 4 | 0 |
| 1988 | 3 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 5 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 1 |
| 2002 | 1 | 1 |
| 2003 | 1 | 8 |
| 2004 | 6 | 6 |
| 2005 | 4 | 3 |
| 2006 | 2 | 0 |
| 2007 | 3 | 1 |
| 2008 | 1 | 1 |
| 2009 | 0 | 0 |
| 2010 | 1 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 1 |
| 2013 | 1 | 1 |
| 2014 | 0 | 3 |
| 2015 | 0 | 1 |
| 2016 | 4 | 2 |
| 2017 | 2 | 2 |
| 2018 | 2 | 3 |
| 2019 | 0 | 5 |
| 2020 | 3 | 8 |
| 2021 | 3 | 2 |
| 2022 | 3 | 7 |
| 2023 | 4 | 4 |
| 2024 | 3 | 7 |
| 2025 | 3 | 5 |
| 2026 | 3 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board19 May 2026US 12,630,715 B2Panasonic Intellectual Property Management Co., Ltd.
- Curable composition10 Feb 2026US 12,545,753 B2Daicel Corporation
- Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device6 Jan 2026US 12,516,139 B2Mitsubishi Gas Chemical Company, Inc.
- Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board10 Jun 2025US 12,325,770 B2Mitsubishi Gas Chemical Company, Inc.
- Polyamic acid resin, polyimide resin, and resin composition including these11 Mar 2025US 12,247,104 B2Nippon Kayaku Kabushiki Kaisha
- Resin composition, prepreg, resin sheet, laminate, metal foil-clad laminate, and printed wiring board13 Aug 2026US 2026/0234331 A1Mitsubishi Gas Chemical Company, Inc.
- Resist composition, method for forming resist pattern, compound, and polymer compound30 Jul 2026US 2026/0219575 A1Tokyo Ohka Kogyo.Co., Ltd.
- Onium salt monomer, polymer, chemically amplified resist composition, and pattern forming process14 May 2026US 2026/0133492 A1Shin-Etsu Chemical Co., Ltd.
- Halogen-free polymeric binder for cathode26 Mar 2026US 2026/0088293 A1Belenos Clean Power Holding AG
- Ionically conductive polymeric binder for cathode26 Mar 2026US 2026/0088297 A1Belenos Clean Power Holding AG
Most cited
By later US patents
- Crosslinkable polymeric compounds52US 4,079,041 ACiba-Geigy Corporation · 1978
- Thermosetting resin composition from maleimide compound and alkenyl phenol48US 4,298,720 AMitsui Toatsu Chemicals, Inc. · 1981
- Polymer from substituted, unsaturated, bicyclic imide48US 4,604,437 ACiba-Geigy Corporation · 1986
- Thermosetting resin compositions containing maleimide and/or vinyl compounds48US 6,790,597 B2Henkel Corporation · 2004
- Polymeric N-substituted maleimide antioxidants43US 4,205,151 ADynapol · 1980