C08F 22/36
Amides or imides
C08F22/36 (Amides or imides) appears on 170 US grants and 166 published applications in this corpus.
Search patents in C08F- Granted patents
- 170
- Published applications
- 166
- Assignees
- 110
- Inventors
- 463
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 4 | 0 |
| 1978 | 1 | 0 |
| 1979 | 6 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 3 | 0 |
| 1986 | 6 | 0 |
| 1987 | 5 | 0 |
| 1988 | 4 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 5 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 3 | 1 |
| 2002 | 1 | 2 |
| 2003 | 1 | 8 |
| 2004 | 6 | 6 |
| 2005 | 5 | 5 |
| 2006 | 2 | 0 |
| 2007 | 3 | 1 |
| 2008 | 2 | 1 |
| 2009 | 0 | 0 |
| 2010 | 1 | 1 |
| 2011 | 0 | 2 |
| 2012 | 1 | 2 |
| 2013 | 3 | 13 |
| 2014 | 1 | 10 |
| 2015 | 3 | 14 |
| 2016 | 12 | 9 |
| 2017 | 9 | 10 |
| 2018 | 12 | 11 |
| 2019 | 10 | 9 |
| 2020 | 5 | 13 |
| 2021 | 5 | 3 |
| 2022 | 6 | 10 |
| 2023 | 6 | 7 |
| 2024 | 6 | 11 |
| 2025 | 3 | 6 |
| 2026 | 4 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board19 May 2026US 12,630,715 B2Panasonic Intellectual Property Management Co., Ltd.
- Photocurable composition and dental product10 Mar 2026US 12,569,410 B2Mitsui Chemicals, Inc.
- Curable composition10 Feb 2026US 12,545,753 B2Daicel Corporation
- Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device6 Jan 2026US 12,516,139 B2Mitsubishi Gas Chemical Company, Inc.
- Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board10 Jun 2025US 12,325,770 B2Mitsubishi Gas Chemical Company, Inc.
- Method to prepare amidated polymers17 Sep 2026US 2026/0275009 A1
- Resin composition, prepreg, resin sheet, laminate, metal foil-clad laminate, and printed wiring board13 Aug 2026US 2026/0234331 A1Mitsubishi Gas Chemical Company, Inc.
- Resist composition, method for forming resist pattern, compound, and polymer compound30 Jul 2026US 2026/0219575 A1Tokyo Ohka Kogyo.Co., Ltd.
- Onium salt monomer, polymer, chemically amplified resist composition, and pattern forming process14 May 2026US 2026/0133492 A1Shin-Etsu Chemical Co., Ltd.
- Polymer derivatives and their use as lipid nanoparticle modifiers30 Apr 2026US 2026/0115143 A1Universite De Liege
Most cited
By later US patents
- Hydrogels that undergo volumetric expansion in response to changes in their environment and their methods of manufacture and use180US 6,878,384 B2MicroVention, Inc. · 2005
- Polymer particles95US 9,688,788 B2Terumo Kabushiki Kaisha · 2017
- Crosslinkable polymeric compounds52US 4,079,041 ACiba-Geigy Corporation · 1978
- Polymeric biocidal agents51US 5,142,010 AH. B. Fuller Licensing & Financing, Inc. · 1992
- Thermosetting resin composition from maleimide compound and alkenyl phenol48US 4,298,720 AMitsui Toatsu Chemicals, Inc. · 1981