Resist composition, method for forming resist pattern, compound, and polymer compound
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsKoshi Onishi, Takashi Nagamine, Yuuki Fujimoto
Life of this patent
Estimating the term…
Loading patent…
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsKoshi Onishi, Takashi Nagamine, Yuuki Fujimoto
Estimating the term…
A resist composition including a resin component having a solubility in a developing solution that changes by an action of an acid, in which the resin component has a constitutional unit represented by General Formula (a0-1). In General Formula (a0-1), R01 and R02 are each independently an alkyl group, a halogenated alkyl group, or a hydrogen atom; Rar is an aromatic ring which may have a substituent; L1 and L2 are each independently a single bond or divalent linking group; R03 represents a fluorinated alkyl group having 1 to 5 carbon atoms, a fluorine atom, or a hydrogen atom; no represents an integer of 1 or greater as long as a valence is allowed; Mm+ represents an m-valent onium cation; and m represents an integer of 1 or greater.
A resist composition which generates an acid upon light exposure and whose solubility in a developing solution is changed by an action of the acid, the resist composition comprising:
A compound represented by General Formula (a0-m1),
A polymer compound having a constitutional unit represented by General Formula (a0-1),
Dependencies are inferred from the claim text.