Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsYuji Nakashima, Takashi Kobayashi, Shunsuke Hirano, Keiichi Hasebe
Life of this patent
Estimating the term…
Abstract
Provided are a resin composition having low dielectric constants and low dielectric loss tangents before moisture absorption (initial state) and after moisture absorption with high metal foil peel strength; and a cured product, a prepreg, a metal foil-clad laminate, a resin sheet, and a printed wiring board in which the resin composition is used. The resin composition contains a compound (A) represented by Formula (M1) and a polymer (B) having a structural unit represented by Formula (V).
Claims19
A resin composition comprising a compound (A) represented by Formula (M1), a polymer (B) having a structural unit represented by Formula (V), and a cyanate ester compound;
- where in Formula (M1), RM1, RM2, RM3, and RM4 each independently represent a hydrogen atom or an organic group;
- RM5 and RM6 each independently represent a hydrogen atom or an alkyl group;
- ArM represents a divalent aromatic group;
- A is a four-to six-membered alicyclic group;
- RM7 and RM8 are each independently an alkyl group;
- mx is 1 or 2;
- 1x is 0 or 1;
- RM9 and RM10 each independently represent a hydrogen atom or an alkyl group;
- RM11, RM12, RM13, and RM14 each independently represent a hydrogen atom or an organic group;
- RM15 each independently represents an alkyl group having from 1 to 10 carbon atom(s), an alkyloxy group having from 1 to 10 carbon atom(s), an alkylthio group having from 1 to 10 carbon atom(s), an aryl group having from 6 to 10 carbon atoms, an aryloxy group having from 1 to 10 carbon atom(s), an arylthiol group having from 1 to 10 carbon atom(s), a halogen atom, a hydroxyl group, or a mercapto group;
- px represents an integer of from 0 to 3;
- and nx represents an integer of from 1 to 20,
- wherein Formula (V), Ar represents an aromatic hydrocarbon linking group;
- and * represents a bond position, where a vinyl group equivalent of the unit represented by the Formula (V) is 200 g/eq or more and 1200 g/eq or less.
Dependencies are inferred from the claim text.