C04B 37/026
Consisting of metals or metal salts
Official title: {consisting of metals or metal salts}
C04B37/026 (Consisting of metals or metal salts) appears on 926 US grants and 721 published applications in this corpus.
Search patents in C04B- Granted patents
- 926
- Published applications
- 721
- Assignees
- 373
- Inventors
- 1,756
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 12 | 0 |
| 1977 | 5 | 0 |
| 1978 | 6 | 0 |
| 1979 | 3 | 0 |
| 1980 | 6 | 0 |
| 1981 | 8 | 0 |
| 1982 | 7 | 0 |
| 1983 | 4 | 0 |
| 1984 | 7 | 0 |
| 1985 | 14 | 0 |
| 1986 | 19 | 0 |
| 1987 | 24 | 0 |
| 1988 | 25 | 0 |
| 1989 | 26 | 0 |
| 1990 | 21 | 0 |
| 1991 | 35 | 0 |
| 1992 | 33 | 0 |
| 1993 | 24 | 0 |
| 1994 | 13 | 0 |
| 1995 | 10 | 0 |
| 1996 | 16 | 0 |
| 1997 | 6 | 0 |
| 1998 | 10 | 0 |
| 1999 | 20 | 0 |
| 2000 | 20 | 0 |
| 2001 | 21 | 8 |
| 2002 | 24 | 27 |
| 2003 | 28 | 23 |
| 2004 | 12 | 28 |
| 2005 | 20 | 20 |
| 2006 | 12 | 11 |
| 2007 | 11 | 14 |
| 2008 | 8 | 18 |
| 2009 | 7 | 21 |
| 2010 | 14 | 31 |
| 2011 | 11 | 16 |
| 2012 | 17 | 43 |
| 2013 | 24 | 24 |
| 2014 | 21 | 42 |
| 2015 | 28 | 39 |
| 2016 | 26 | 47 |
| 2017 | 35 | 36 |
| 2018 | 32 | 37 |
| 2019 | 42 | 22 |
| 2020 | 27 | 29 |
| 2021 | 20 | 31 |
| 2022 | 19 | 38 |
| 2023 | 19 | 45 |
| 2024 | 32 | 29 |
| 2025 | 25 | 29 |
| 2026 | 17 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Metal-ceramic substrate, method for the production thereof, and module28 Jul 2026US 12,692,202 B2Heraeus Electronics GmbH & Co. KG
- Bonded substrate14 Jul 2026US 12,679,778 B2NGK Insulators, Ltd.
- Bonded body, ceramic-copper circuit board, and semiconductor device26 May 2026US 12,642,091 B2Niterra Materials Co., Ltd.
- Device comprising a ceramic substrate and method for producing same19 May 2026US 12,635,519 B2Robert Bosch GmbH
- Copper/ceramic assembly and insulating circuit substrate12 May 2026US 12,628,646 B2Mitsubishi Materials Corporation
- Metal-ceramic substrate and process for producing a metal-ceramic substrate20 Aug 2026US 2026/0242289 A1
- Bonded body13 Aug 2026US 2026/0234066 A1NGK Corporation
- Method for producing a metal-ceramic substrate, and metal-ceramic substrate produced using such a method13 Aug 2026US 2026/0239541 A1
- Heat Dissipation Substrate for a Power Semiconductor Module, Manufacturing Method thereof, and Convertor including the same13 Aug 2026US 2026/0239967 A1Lx Semicon Co., Ltd.
- Heat Dissipation Substrate for Power Semiconductor, Power Semiconductor Module including the same, Power Convertor including the same, and Manufacturing method thereof13 Aug 2026US 2026/0239968 A1Lx Semicon Co., Ltd.
Most cited
By later US patents
- Compact of boron-doped diamond and method for making same385US 4,268,276 AGeneral Electric Company · 1981
- Electrostatic chuck having gas cavity and method244US 6,310,755 B1APPLIED Materials.Inc. · 2001
- Functionally stepped, resistive ceramic163US 5,880,439 APhilip Morris Incorporated · 1999
- Multilayer coated abrasive element for bonding to a backing162US 5,049,164 ANorton Company · 1991
- Thermally stable diamond abrasive compact body157US 4,940,180 A1990