C04B 2237/68
Forming laminates or joining articles wherein at least one substrate contains at
Official title: Forming laminates or joining articles wherein at least one substrate contains at least two different parts of macro-size, e.g. one ceramic substrate layer containing an embedded conductor or electrode
C04B2237/68 (Forming laminates or joining articles wherein at least one substrate contains at) appears on 376 US grants and 406 published applications in this corpus.
Search patents in C04B- Granted patents
- 376
- Published applications
- 406
- Assignees
- 157
- Inventors
- 1,029
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 4 | 0 |
| 1989 | 3 | 0 |
| 1990 | 5 | 0 |
| 1991 | 4 | 0 |
| 1992 | 6 | 0 |
| 1993 | 8 | 0 |
| 1994 | 6 | 0 |
| 1995 | 9 | 0 |
| 1996 | 8 | 0 |
| 1997 | 11 | 0 |
| 1998 | 9 | 0 |
| 1999 | 9 | 0 |
| 2000 | 4 | 0 |
| 2001 | 4 | 7 |
| 2002 | 10 | 22 |
| 2003 | 16 | 18 |
| 2004 | 15 | 18 |
| 2005 | 6 | 16 |
| 2006 | 9 | 10 |
| 2007 | 2 | 9 |
| 2008 | 9 | 9 |
| 2009 | 4 | 18 |
| 2010 | 6 | 17 |
| 2011 | 12 | 14 |
| 2012 | 13 | 12 |
| 2013 | 5 | 10 |
| 2014 | 9 | 9 |
| 2015 | 7 | 19 |
| 2016 | 16 | 20 |
| 2017 | 21 | 29 |
| 2018 | 11 | 10 |
| 2019 | 11 | 13 |
| 2020 | 11 | 18 |
| 2021 | 14 | 17 |
| 2022 | 10 | 17 |
| 2023 | 13 | 23 |
| 2024 | 28 | 18 |
| 2025 | 15 | 24 |
| 2026 | 10 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of manufacturing multilayer electronic component18 Aug 2026US 12,712,131 B2Samsung Electro-Mechanics Co., Ltd.
- Multilayer ceramic capacitor and method of manufacturing the same23 Jun 2026US 12,665,132 B2Samsung Electro-Mechanics Co., Ltd.
- Ceramic plate19 May 2026US 12,635,466 B2NGK Insulators, Ltd.
- Multilayered capacitor and manufacturing method thereof24 Mar 2026US 12,586,728 B2Samsung Electro-Mechanics Co., Ltd.
- Corrosion-resistant components3 Mar 2026US 12,567,564 B2CoorsTek, Inc.
- Dielectric ceramic, method of preparing the same, and multilayer ceramic capacitor including the same8 Oct 2026US 2026/0311933 A1Samsung Electro-Mechanics Co., Ltd.
- Multilayer ceramic electronic device24 Sep 2026US 2026/0285764 A1TDK Corporation
- Bonded body13 Aug 2026US 2026/0234066 A1NGK Corporation
- Corrosion resistant power electronic modules30 Jul 2026US 2026/0223709 A1Rockwell Automation Technologies, Inc.
- Dielectric composition, dielectric element, and laminated electronic component23 Jul 2026US 2026/0209124 A1Niterra Co., Ltd.
Most cited
By later US patents
- Integrated multilayered microfludic devices and methods for making the same242US 6,572,830 B1Motorola, Inc. · 2003
- Multilayered microfluidic DNA analysis system and method238US 6,544,734 B12003
- Multilayered ferroelectric composite waveguides216US 5,830,591 A1998
- Cutting elements and methods of manufacture thereof160US 6,248,447 B1Camco International (UK) Limited · 2001
- Multilayered microfluidic DNA analysis system and method122US 6,984,516 B2Motorola, Inc. · 2006