Method of manufacturing multilayer electronic component

A method of manufacturing a multilayer electronic component, the method comprising:

• a stack forming operation of forming a stack, by stacking a plurality of ceramic green sheets on which conductive patterns are disposed, on a support film, a direction in which the plurality of ceramic green sheets are stacked relative to the stack being a first direction;
• a stack cutting operation of cutting the stack in a second direction, perpendicular to the first direction, and cutting the stack in a third direction, perpendicular to the first and second directions, to obtain a plurality of unit chips such that one of the plurality of unit chips includes a first internal electrode pattern in which a cut surface of the conductive pattern is exposed to one surface of the one unit chip in the second direction and first and second side surfaces opposing each other in the third direction, and a second internal electrode pattern in which the cut surface of the conductive pattern is exposed to the other surface of the one unit chip in the second direction and the first and second side surfaces;
• an arrangement operation of separating the one unit chip from the support film without rotating the one unit chip with respect to the support film, and arranging the one unit chip such that the second side surface of the one unit chip is in contact with an adhesive tape;
• and
• a first side margin portion formation operation of attaching the first side surface directly to a ceramic green sheet for a side margin portion, and forming a first side margin portion on the first side surface of the one unit chip.

A method of manufacturing a multilayer electronic component, the method comprising:

• forming a stack, by stacking a plurality of ceramic green sheets on which conductive patterns are disposed, on a support film;
• cutting the stack on the support film to form an array of unit chips;
• transferring the array of unit chips from the support film to an adhesive tape such that a cut surface among a plurality of surfaces of each unit chip becomes a temporary mounting surface being mounted on and in contact with the adhesive tape;
• and
• attaching a ceramic green sheet for a side margin portion directly on a surface of each unit chip opposing the temporary mounting surface thereof to form a first side margin portion on each unit chip,
• wherein the transferring is performed in a state in which the cut surface among the plurality of surfaces of a respective one of the unit chips which is disposed on the support film and which is to be transferred faces a plane of the adhesive tape.