C04B 2237/60
Forming at the joining interface or in the joining layer specific reaction
Official title: Forming at the joining interface or in the joining layer specific reaction phases or zones, e.g. diffusion of reactive species from the interlayer to the substrate or from a substrate to the joining interface, carbide forming at the joining interface
C04B2237/60 (Forming at the joining interface or in the joining layer specific reaction) appears on 265 US grants and 242 published applications in this corpus.
Search patents in C04B- Granted patents
- 265
- Published applications
- 242
- Assignees
- 161
- Inventors
- 591
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 4 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 5 | 0 |
| 1982 | 4 | 0 |
| 1983 | 5 | 0 |
| 1984 | 3 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 4 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 5 | 0 |
| 1991 | 4 | 0 |
| 1992 | 6 | 0 |
| 1993 | 5 | 0 |
| 1994 | 3 | 0 |
| 1995 | 6 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 7 | 0 |
| 2000 | 3 | 0 |
| 2001 | 8 | 4 |
| 2002 | 4 | 11 |
| 2003 | 9 | 2 |
| 2004 | 2 | 10 |
| 2005 | 3 | 2 |
| 2006 | 1 | 1 |
| 2007 | 1 | 4 |
| 2008 | 1 | 3 |
| 2009 | 0 | 3 |
| 2010 | 4 | 5 |
| 2011 | 3 | 5 |
| 2012 | 3 | 18 |
| 2013 | 10 | 15 |
| 2014 | 8 | 14 |
| 2015 | 11 | 12 |
| 2016 | 10 | 19 |
| 2017 | 7 | 17 |
| 2018 | 15 | 9 |
| 2019 | 14 | 10 |
| 2020 | 10 | 14 |
| 2021 | 12 | 9 |
| 2022 | 6 | 11 |
| 2023 | 3 | 17 |
| 2024 | 17 | 11 |
| 2025 | 4 | 8 |
| 2026 | 10 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Composite ceramic substrate having multi-layer configuration29 Sep 2026US 12,747,191 B2Tong Hsing Electronic Industries, Ltd.
- Graphite-based infrastructures for handling molten metals and methods of forming thereof21 Jul 2026US 12,686,645 B2Fourth Power, Inc.
- Ceramic joint body, method of manufacturing the same, and mixing member for liquid chromatography9 Jun 2026US 12,650,413 B2KYOCERA Corporation
- Ceramic plate19 May 2026US 12,635,466 B2NGK Insulators, Ltd.
- Copper/ceramic assembly and insulating circuit substrate12 May 2026US 12,628,646 B2Mitsubishi Materials Corporation
- Metal-ceramic substrate and process for producing a metal-ceramic substrate20 Aug 2026US 2026/0242289 A1
- Method for Obtaining at Least One Ceramic Component by Joining at Least Two Ceramic SIC Preforms and Ceramic Components Obtained by Said Method20 Aug 2026US 2026/0242299 A1CeramTec GmbH
- Bonded body13 Aug 2026US 2026/0234066 A1NGK Corporation
- Heat Dissipation Substrate for a Power Semiconductor Module, Manufacturing Method thereof, and Convertor including the same13 Aug 2026US 2026/0239967 A1Lx Semicon Co., Ltd.
- Heat Dissipation Substrate for Power Semiconductor, Power Semiconductor Module including the same, Power Convertor including the same, and Manufacturing method thereof13 Aug 2026US 2026/0239968 A1Lx Semicon Co., Ltd.
Most cited
By later US patents
- Electrostatic chuck having gas cavity and method244US 6,310,755 B1APPLIED Materials.Inc. · 2001
- Method for joining ceramic shapes128US 5,139,594 AThe United States of America as represented by the United States Department of Energy · 1992
- Microwave technique for brazing materials111US 6,054,693 ACalifornia Institute of Technology · 2000
- Method of making reactive multilayer foil and resulting product95US 6,534,194 B2The Johns Hopkins University · 2003
- Method of attaching ceramics to metals for high temperature operation and laminated composite91US 4,338,380 ABrunswick Corporation · 1982