C04B 2237/55
Pre-treatments of a coated or not coated substrate other than oxidation treatment
Official title: Pre-treatments of a coated or not coated substrate other than oxidation treatment in order to form an active joining layer
C04B2237/55 (Pre-treatments of a coated or not coated substrate other than oxidation treatment) appears on 120 US grants and 108 published applications in this corpus.
Search patents in C04B- Granted patents
- 120
- Published applications
- 108
- Assignees
- 90
- Inventors
- 344
- Latest grant
- 3 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 4 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 5 | 0 |
| 2000 | 4 | 0 |
| 2001 | 2 | 0 |
| 2002 | 2 | 2 |
| 2003 | 1 | 3 |
| 2004 | 2 | 3 |
| 2005 | 3 | 1 |
| 2006 | 1 | 1 |
| 2007 | 1 | 3 |
| 2008 | 1 | 4 |
| 2009 | 1 | 0 |
| 2010 | 2 | 4 |
| 2011 | 1 | 4 |
| 2012 | 2 | 6 |
| 2013 | 4 | 5 |
| 2014 | 6 | 11 |
| 2015 | 1 | 7 |
| 2016 | 5 | 9 |
| 2017 | 8 | 6 |
| 2018 | 4 | 3 |
| 2019 | 4 | 6 |
| 2020 | 5 | 7 |
| 2021 | 6 | 3 |
| 2022 | 4 | 7 |
| 2023 | 3 | 3 |
| 2024 | 7 | 2 |
| 2025 | 3 | 5 |
| 2026 | 1 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Joined body3 Feb 2026US 12,539,690 B2NGK Insulators, Ltd.
- Process for producing a metal-ceramic substrate, and a metal-ceramic substrate produced using such method9 Dec 2025US 12,495,491 B2Rogers Germany GmbH
- Bonding method for copper-copper metal with hydrazine hydrate3 Jun 2025US 12,322,724 B2Anhui University
- Continuous fiber-reinforced silicon carbide member, manufacturing method thereof, and nuclear reactor structural member20 May 2025US 12,304,176 B2Kabushiki Kaisha Toshiba
- Joining material with silicon carbide particles and reactive additives31 Dec 2024US 12,180,122 B2Rolls-Royce High Temperature Composites Inc.
- Heat Dissipation Substrate for a Power Semiconductor Module, Manufacturing Method thereof, and Convertor including the same13 Aug 2026US 2026/0239967 A1Lx Semicon Co., Ltd.
- Heat Dissipation Substrate for Power Semiconductor, Power Semiconductor Module including the same, Power Convertor including the same, and Manufacturing method thereof13 Aug 2026US 2026/0239968 A1Lx Semicon Co., Ltd.
- Composite substrate and device6 Aug 2026US 2026/0226657 A1NGK Insulators, Ltd.
- Heat dissipation substrate for a power semiconductor module and a converter including the same9 Oct 2025US 2025/0316557 A1Lx Semicon Co., Ltd.
- Graphite-mullite joint formation31 Jul 2025US 2025/0243126 A1Honeywell International Inc.
Most cited
By later US patents
- Supported polycrystalline compacts67US 4,797,326 AGeneral Electric Company · 1989
- Bonded member comprising different materials, and production method thereof65US 6,918,530 B2NGK Insulators, Ltd. · 2005
- Method for direct bonding nitride bodies50US 5,904,860 ANippondenso Co., Ltd. · 1999
- Method for producing abrasive grains and the composite abrasive grains produced by same47US 6,179,886 B2Ambler Technologies, Inc. · 2001
- Surface preparation of ceramic substrates for metallization39US 4,647,477 AKollmorgen Technologies Corporation · 1987