C04B 2237/555
On a substrate not containing an interlayer coating, leading to the formation
Official title: on a substrate not containing an interlayer coating, leading to the formation of an interlayer coating
C04B2237/555 (On a substrate not containing an interlayer coating, leading to the formation) appears on 20 US grants and 23 published applications in this corpus.
Search patents in C04B- Granted patents
- 20
- Published applications
- 23
- Assignees
- 18
- Inventors
- 63
- Latest grant
- 21 May 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 1 | 3 |
| 2012 | 1 | 3 |
| 2013 | 3 | 3 |
| 2014 | 3 | 2 |
| 2015 | 0 | 0 |
| 2016 | 2 | 2 |
| 2017 | 1 | 2 |
| 2018 | 0 | 0 |
| 2019 | 0 | 2 |
| 2020 | 1 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 1 |
| 2024 | 1 | 0 |
| 2025 | 0 | 3 |
By publication year. Applications have been published since 2001.
Recent patents
- Ceramic matrix composite component and method of producing the same21 May 2024US 11,987,533 B2IHI Corporation
- Ceramics wringing9 Jun 2020US 10,676,400 B2CeramTec-ETEC GmbH
- Sample holder7 Mar 2017US 9,589,826 B2KYOCERA Corporation
- Polycrystalline diamond compact including a substrate having a raised interfacial surface bonded to a polycrystalline diamond table, and applications therefor6 Sep 2016US 9,435,160 B2US Synthetic Corporation
- Transient liquid phase, pressureless joining of aluminum nitride components17 May 2016US 9,340,462 B2Oasis Materials Corporation
- Heat dissipation substrate for a power semiconductor module and a converter including the same9 Oct 2025US 2025/0316557 A1Lx Semicon Co., Ltd.
- Graphite-mullite joint formation31 Jul 2025US 2025/0243126 A1Honeywell International Inc.
- Laminate, antenna-in-packaging, and methods of making the same10 Jul 2025US 2025/0223235 A1Corning Incorporated
- Composite wafer and manufacturing method therefor7 Dec 2023US 2023/0391055 A1Shin-Etsu Chemical Co., Ltd.
- Ceramic matrix composite component and method of producing the same7 Mar 2019US 2019/0071364 A1IHI Corporation
Most cited
By later US patents
- Method for direct bonding nitride bodies50US 5,904,860 ANippondenso Co., Ltd. · 1999
- Power module board and power module using the board37US 6,122,170 ASumitomo Electric Industries, Ltd. · 2000
- Polycrystalline diamond compact including a substrate having a raised interfacial surface bonded to a leached polycrystalline diamond table, and applications therefor37US 8,353,371 B2US Synthetic Corporation · 2013
- Polycrystalline diamond compact including a cemented tungsten carbide substrate that is substantially free of tungsten carbide grains exhibiting abnormal grain growth and applications therefor29US 8,069,937 B2US Synthetic Corporation · 2011
- Surface bonding of ceramic bodies27US 4,824,008 ALanxide Technology Company, LP · 1989