US 6,122,170 AGranted

Power module board and power module using the board

AssigneeSumitomo Electric Industries, Ltd.

InventorsYoshiyuki Hirose, Kazutaka Sasaki, Mitsuru Shimazu, Hirohiko Nakata

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Abstract

A ceramic base plate of aluminum nitride ceramics, for example, as a power module board has a metal layer on a surface of the ceramic base plate at a fixing portion at which the ceramic base plate is fixed onto a heat radiating plate. Further, a metal film is provided entirely on the rear surface of the ceramic base plate. An IGBT chip or the like is fixed onto the ceramic base plate with a conductive layer interposed therebetween, to form a power module board. Therefore, it is possible to avoid the generation of cracks when the ceramic base plate is mechanically fixed onto the heat radiating plate without using solder, and heat radiation from the ceramic base plate to the heat radiating plate can be improved.

Claims12

Dependent claims

A power module board comprising a ceramic base plate, a current control unit arranged on a first portion of said ceramic base plate, and a fixing portion for fixing said ceramic base plate onto another plate, situated at a second portion of said ceramic base plate, wherein:

said current control unit includes a stacked structure comprising a first intervening layer stacked on said first portion of said ceramic base plate and a conductive layer stacked on said first intervening layer with said first intervening layer being interposed between said conductive layer and said first portion of said ceramic base plate, and a semiconductor device mounted on an uppermost surface of said stacked structure oriented away from said ceramic base plate;
said current control unit is sealed;
said fixing portion includes a fixing seat area comprising a second intervening layer arranged on said second portion of said ceramic base plate and a metal layer arranged on said second intervening layer with said second intervening layer being interposed between said metal layer and said second portion of said ceramic base plate.

Dependencies are inferred from the claim text.

Facts

Application: 09/343,167Filed 29 Jun 1999
Priority: JP 10-18421730 Jun 1998
Granted: 19 Sep 2000
Term ends: Not estimatedThe source records don’t support an estimate.

Classification28 codes

H10W 70/65
Characterised by their interconnections: shapes or dispositions of interconnections
C04B 35/581
Based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides: based on aluminium nitride
C04B 35/584
Based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides: based on silicon nitride
C04B 35/62625
Treating the starting powders individually or as mixtures: wet mixtures