C04B 2237/06
Oxidic interlayers
C04B2237/06 (Oxidic interlayers) appears on 530 US grants and 459 published applications in this corpus.
Search patents in C04B- Granted patents
- 530
- Published applications
- 459
- Assignees
- 316
- Inventors
- 1,275
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 10 | 0 |
| 1977 | 3 | 0 |
| 1978 | 5 | 0 |
| 1979 | 3 | 0 |
| 1980 | 5 | 0 |
| 1981 | 4 | 0 |
| 1982 | 7 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 8 | 0 |
| 1986 | 5 | 0 |
| 1987 | 3 | 0 |
| 1988 | 6 | 0 |
| 1989 | 8 | 0 |
| 1990 | 7 | 0 |
| 1991 | 11 | 0 |
| 1992 | 19 | 0 |
| 1993 | 14 | 0 |
| 1994 | 18 | 0 |
| 1995 | 11 | 0 |
| 1996 | 4 | 0 |
| 1997 | 3 | 0 |
| 1998 | 11 | 0 |
| 1999 | 13 | 0 |
| 2000 | 9 | 0 |
| 2001 | 7 | 5 |
| 2002 | 14 | 17 |
| 2003 | 15 | 15 |
| 2004 | 15 | 18 |
| 2005 | 6 | 12 |
| 2006 | 8 | 22 |
| 2007 | 9 | 15 |
| 2008 | 5 | 19 |
| 2009 | 7 | 33 |
| 2010 | 17 | 21 |
| 2011 | 14 | 18 |
| 2012 | 15 | 24 |
| 2013 | 15 | 12 |
| 2014 | 15 | 19 |
| 2015 | 19 | 31 |
| 2016 | 14 | 24 |
| 2017 | 21 | 19 |
| 2018 | 21 | 12 |
| 2019 | 17 | 19 |
| 2020 | 9 | 20 |
| 2021 | 13 | 16 |
| 2022 | 6 | 18 |
| 2023 | 22 | 19 |
| 2024 | 16 | 11 |
| 2025 | 12 | 11 |
| 2026 | 7 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Multilayer sintered ceramic body14 Jul 2026US 12,679,777 B2Heraeus Covantics North America LLC
- Compliant suture-based joinery21 Apr 2026US 12,606,495 B2Lawrence Livermore National Security, LLC
- Corrosion-resistant components3 Mar 2026US 12,567,564 B2CoorsTek, Inc.
- Methods of preparing metal sheets for a DCB / DAB substrate bonding process10 Feb 2026US 12,545,011 B2Littelfuse, Inc.
- Ceramic joined body, electrostatic chucking device, and method for producing ceramic joined body27 Jan 2026US 12,538,748 B2Sumitomo Osaka Cement Co., Ltd.
- Metal-ceramic substrate and process for producing a metal-ceramic substrate20 Aug 2026US 2026/0242289 A1
- Copper-ceramic substrate with an upper face which can be sintered20 Aug 2026US 2026/0248008 A1Heraeus Electronics GmbH & Co. KG
- Copper-ceramic substrate with an upper face which can be sintered20 Aug 2026US 2026/0248009 A1Heraeus Electronics GmbH & Co. KG
- Bonded body13 Aug 2026US 2026/0234066 A1NGK Corporation
- Copper-ceramic substrate with an upper face which can be sintered13 Aug 2026US 2026/0240018 A1Heraeus Electronics GmbH & Co. KG
Most cited
By later US patents
- Composite materials156US 4,055,451 A1977
- Ceramic matrix composite turbine vane148US 6,648,597 B1Siemens Westinghouse Power Corporation · 2003
- Direct bonding of metals to ceramics and metals132US 3,994,430 AGeneral Electric Company · 1976
- Living hard tissue replacement, its preparation127US 5,125,971 ATDK Corporation · 1992
- Low temperature reaction bonding104US 5,427,638 AAlliedSignal Inc. · 1995