B81C 3/008
Aspects related to assembling from individually processed components, not covered by groups
Official title: {Aspects related to assembling from individually processed components, not covered by groups B81C3/001 - B81C3/002}
B81C3/008 (Aspects related to assembling from individually processed components, not covered by groups) appears on 82 US grants and 93 published applications in this corpus.
Search patents in B81C- Granted patents
- 82
- Published applications
- 93
- Assignees
- 79
- Inventors
- 215
- Latest grant
- 31 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 3 |
| 2003 | 1 | 8 |
| 2004 | 5 | 2 |
| 2005 | 6 | 6 |
| 2006 | 8 | 6 |
| 2007 | 1 | 6 |
| 2008 | 3 | 4 |
| 2009 | 2 | 5 |
| 2010 | 2 | 7 |
| 2011 | 4 | 4 |
| 2012 | 4 | 5 |
| 2013 | 7 | 7 |
| 2014 | 5 | 5 |
| 2015 | 6 | 4 |
| 2016 | 4 | 0 |
| 2017 | 2 | 0 |
| 2018 | 2 | 5 |
| 2019 | 2 | 2 |
| 2020 | 2 | 4 |
| 2021 | 3 | 3 |
| 2022 | 2 | 2 |
| 2023 | 5 | 3 |
| 2024 | 1 | 0 |
| 2025 | 0 | 1 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Hybrid release layer for microdevice cartridge31 Mar 2026US 12,593,656 B2VueReal Inc.
- Semi-finished product and method for producing a semi-finished product comprising at least one microcomponent9 Jul 2024US 12,030,228 B2BETA Beratungs- und Beteiligungs-GmbH
- Wafer level stacked structures having integrated passive features26 Dec 2023US 11,854,958 B2General Electric Company
- Fabrication of 3D microelectrodes and use thereof in multi-functional biosystems12 Dec 2023US 11,840,446 B2University of Central Florida Research Foundation, Inc.
- Systems and methods for manufacturing closed microfluidic devices18 Jul 2023US 11,701,652 B2The Charles Stark Draper Laboratory, Inc.
- Hybrid release layer for microdevice cartridge9 Jul 2026US 2026/0198265 A1VueReal Inc.
- Systems and methods for mechanically interlocking structures and metamaterials for component integration18 Dec 2025US 2025/0382171 A1University of Hawaii
- Microdevice block transfer28 Sep 2023US 2023/0307575 A1VueReal Inc.
- Hybrid release layer for microdevice cartridge20 Jul 2023US 2023/0230869 A1VueReal Inc.
- Method for producing a microelectronic device2 Mar 2023US 2023/0065179 A1
Most cited
By later US patents
- Structure for micro-machine optical tooling and method for making and using166US 6,049,650 ASeagate Technology LLC · 2000
- Structures, systems and methods for joining articles and materials and uses therefor92US 7,056,409 B2Nanosys, Inc. · 2006
- Separation column devices and fabrication methods76US 6,923,907 B2Nanostream, Inc. · 2005
- Microfluidic devices with distributing inputs70US 6,981,522 B2Nanostream, Inc. · 2006
- Frit material and bonding method for microfluidic separation devices63US 6,814,859 B2Nanostream, Inc. · 2004