Microdevice block transfer
AssigneeVueReal Inc.
InventorsGholamreza CHAJI, Lauren LESERGENT
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Abstract
What is disclosed is structures and methods of integrating blocks of microdevices into the system backplane. Process is outlined for forming blocks of microdevices and forming of transfer templates to facilitate transfer of blocks of microdevices to the system backplane. Further, aspects deal with microdevices forming blocks from different wafers and substrates.
Claims44
A method to transfer microdevices to a system backplane, the method comprising:
- embedding microdevices in a housing structure with a buffer layer;
- bonding the housing structure to a temporary substrate with a bonding layer;
- having a release layer between the housing structure and the temporary substrate;
- singulating the housing structure around a set of microdevices forming blocks of microdevices;
- and
- using the blocks of microdevices to form a transfer template for transferring the microdevices into the system backplane.
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Dependencies are inferred from the claim text.