B81C 3/001
Bonding of two components
Official title: {Bonding of two components}
B81C3/001 (Bonding of two components) appears on 337 US grants and 450 published applications in this corpus.
Search patents in B81C- Granted patents
- 337
- Published applications
- 450
- Assignees
- 241
- Inventors
- 931
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 1 |
| 2002 | 2 | 8 |
| 2003 | 6 | 6 |
| 2004 | 7 | 16 |
| 2005 | 8 | 19 |
| 2006 | 11 | 23 |
| 2007 | 3 | 10 |
| 2008 | 13 | 10 |
| 2009 | 9 | 8 |
| 2010 | 9 | 15 |
| 2011 | 5 | 11 |
| 2012 | 9 | 15 |
| 2013 | 6 | 11 |
| 2014 | 16 | 34 |
| 2015 | 22 | 29 |
| 2016 | 23 | 23 |
| 2017 | 23 | 30 |
| 2018 | 18 | 33 |
| 2019 | 23 | 27 |
| 2020 | 23 | 25 |
| 2021 | 31 | 18 |
| 2022 | 16 | 27 |
| 2023 | 11 | 14 |
| 2024 | 19 | 16 |
| 2025 | 16 | 14 |
| 2026 | 5 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Resonance device with anti-diffusion layer and resonance device manufacturing method25 Aug 2026US 12,719,443 B2Murata Manufacturing Co., Ltd.
- Microelectromechanical element and a method for manufacturing it28 Jul 2026US 12,692,151 B2Murata Manufacturing Co., Ltd.
- Rosette strain gage and method of fabrication21 Apr 2026US 12,607,526 B1Piezo-Metrics Inc
- Dual micro-electro mechanical system and manufacturing method thereof7 Apr 2026US 12,595,167 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Micro-electro mechanical system and manufacturing method thereof24 Feb 2026US 12,559,362 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Dual micro-electro mechanical system and manufacturing method thereof23 Jul 2026US 2026/0209033 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Micro-electro mechanical system and manufacturing method thereof4 Jun 2026US 2026/0152385 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Laser welding of microfluidic components14 May 2026US 2026/0131399 A1Parallel Fluidics
- Forming a Bonded Interface Using Plasma-Activated Surfaces9 Apr 2026US 2026/0097953 A1Quantum Valley Ideas Laboratories
- Plasma bonding formation of direct electrical and fluidic interconnects9 Apr 2026US 2026/0101813 A1Hewlett-Packard Development Company, L. P.
Most cited
By later US patents
- Method of fabrication of a AL/GE bonding in a wafer packaging environment and a product produced therefrom155US 7,442,570 B2Invensence Inc. · 2008
- Methods of manufacturing microfabricated substrates127US 6,425,972 B1Calipher Technologies Corp. · 2002
- Methods and devices for enhancing bonded substrate yields and regulating temperature116US 7,351,377 B2Caliper Life Sciences, Inc. · 2008
- Fluid circuit components based upon passive fluid dynamics113US 6,601,613 B2BioMicro Systems, Inc. · 2003
- Bonding a non-metal body to a metal surface using inductive heating70US 7,452,800 B2The Regents of the University of California · 2008