B32B 43/006
Delaminating
Official title: {Delaminating}
B32B43/006 (Delaminating) appears on 1,020 US grants and 1,327 published applications in this corpus.
Search patents in B32B- Granted patents
- 1,020
- Published applications
- 1,327
- Assignees
- 571
- Inventors
- 2,788
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 4 | 0 |
| 1995 | 2 | 0 |
| 1996 | 4 | 0 |
| 1997 | 1 | 0 |
| 1998 | 5 | 0 |
| 1999 | 4 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 0 |
| 2002 | 3 | 4 |
| 2003 | 4 | 4 |
| 2004 | 3 | 5 |
| 2005 | 4 | 10 |
| 2006 | 3 | 6 |
| 2007 | 3 | 4 |
| 2008 | 5 | 15 |
| 2009 | 4 | 24 |
| 2010 | 5 | 19 |
| 2011 | 9 | 20 |
| 2012 | 22 | 26 |
| 2013 | 13 | 61 |
| 2014 | 36 | 88 |
| 2015 | 45 | 138 |
| 2016 | 91 | 109 |
| 2017 | 83 | 84 |
| 2018 | 104 | 98 |
| 2019 | 112 | 98 |
| 2020 | 73 | 89 |
| 2021 | 70 | 77 |
| 2022 | 78 | 64 |
| 2023 | 66 | 85 |
| 2024 | 54 | 66 |
| 2025 | 60 | 70 |
| 2026 | 41 | 63 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Laser recovery of a core layer of a temporary carrier structure29 Sep 2026US 12,751,028 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Laminate, release agent composition, and method for producing processed semiconductor substrate15 Sep 2026US 12,734,784 B2Nissan Chemical Corporation
- Laminate, method of manufacturing laminate, and method of manufacturing optical member15 Sep 2026US 12,736,840 B2FUJIFILM Corporation
- Thermal debonding of primer-initiated curable structural adhesive films8 Sep 2026US 12,729,307 B23M Innovative Properties Company
- Method for producing wiring board25 Aug 2026US 12,721,211 B2Mitsui Kinzoku Company, Limited
- Adhesive composition, laminate, method of manufacturing laminate, and method of manufacturing processed substrate24 Sep 2026US 2026/0286189 A1Nissan Chemical Corporation
- Pressure-sensitive adhesive compound, adhesive tape, bonded assembly and method for electrically debonding the bonded assembly24 Sep 2026US 2026/0286194 A1Tesa SE
- Paper stripping apparatus, paper stripping method, adhesive pasting device, and adhesive pasting method17 Sep 2026US 2026/0273915 A1Contemporary Amperex Technology Co., Limited
- Systems and methods of automatic film removal3 Sep 2026US 2026/0257390 A1General Electric Company
- Methods of recovering electrode active materials from lithium-ion batteries and electrodes thereof3 Sep 2026US 2026/0260957 A1The Trustees of Indiana University
Most cited
By later US patents
- Peeling method and method of manufacturing semiconductor device137US 7,351,300 B2Semiconductor Energy Laboratory Co.Ltd. · 2008
- Tamper indicating labels106US 4,121,003 AMonarch Marking Systems, Inc. · 1978
- Optical stack of laminated removable lenses for face shields windows and displays89US 6,388,813 B12002
- Apparatus and methods for wafer debonding using a liquid jet76US 5,783,022 ASamsung Electronics Co., Ltd. · 1998
- Nozzle for cleaving substrates71US 6,263,941 B1Silicon Genesis Corporation · 2001