B32B 43/00
Operations specially adapted for layered products and not otherwise provided for
Official title: Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
B32B43/00 (Operations specially adapted for layered products and not otherwise provided for) appears on 1,241 US grants and 1,559 published applications in this corpus.
Search patents in B32B- Granted patents
- 1,241
- Published applications
- 1,559
- Assignees
- 695
- Inventors
- 3,338
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 9 | 0 |
| 1990 | 3 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 4 | 0 |
| 1995 | 4 | 0 |
| 1996 | 8 | 0 |
| 1997 | 4 | 0 |
| 1998 | 12 | 0 |
| 1999 | 7 | 0 |
| 2000 | 7 | 0 |
| 2001 | 5 | 1 |
| 2002 | 4 | 5 |
| 2003 | 7 | 9 |
| 2004 | 8 | 9 |
| 2005 | 4 | 13 |
| 2006 | 6 | 9 |
| 2007 | 6 | 11 |
| 2008 | 6 | 23 |
| 2009 | 7 | 27 |
| 2010 | 7 | 28 |
| 2011 | 10 | 29 |
| 2012 | 26 | 35 |
| 2013 | 23 | 73 |
| 2014 | 43 | 103 |
| 2015 | 56 | 155 |
| 2016 | 104 | 120 |
| 2017 | 100 | 96 |
| 2018 | 114 | 110 |
| 2019 | 125 | 117 |
| 2020 | 85 | 100 |
| 2021 | 80 | 83 |
| 2022 | 86 | 73 |
| 2023 | 74 | 95 |
| 2024 | 62 | 83 |
| 2025 | 67 | 80 |
| 2026 | 48 | 72 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Laser recovery of a core layer of a temporary carrier structure29 Sep 2026US 12,751,028 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Laminate, release agent composition, and method for producing processed semiconductor substrate15 Sep 2026US 12,734,784 B2Nissan Chemical Corporation
- Multi-layered structure and method for producing same15 Sep 2026US 12,734,790 B2Nitto Denko Corporation
- Laminate, method of manufacturing laminate, and method of manufacturing optical member15 Sep 2026US 12,736,840 B2FUJIFILM Corporation
- Thermal debonding of primer-initiated curable structural adhesive films8 Sep 2026US 12,729,307 B23M Innovative Properties Company
- Adhesive composition, laminate, method of manufacturing laminate, and method of manufacturing processed substrate24 Sep 2026US 2026/0286189 A1Nissan Chemical Corporation
- Pressure-sensitive adhesive compound, adhesive tape, bonded assembly and method for electrically debonding the bonded assembly24 Sep 2026US 2026/0286194 A1Tesa SE
- Paper stripping apparatus, paper stripping method, adhesive pasting device, and adhesive pasting method17 Sep 2026US 2026/0273915 A1Contemporary Amperex Technology Co., Limited
- Systems and methods of automatic film removal3 Sep 2026US 2026/0257390 A1General Electric Company
- Methods of recovering electrode active materials from lithium-ion batteries and electrodes thereof3 Sep 2026US 2026/0260957 A1The Trustees of Indiana University
Most cited
By later US patents
- Lift-off and subsequent bonding of epitaxial films217US 4,883,561 ABell Communications Research, Inc. · 1989
- Method for lifting-off epitaxial films158US 4,846,931 ABell Communications Research, Inc. · 1989
- Peeling method and method of manufacturing semiconductor device137US 7,351,300 B2Semiconductor Energy Laboratory Co.Ltd. · 2008
- Composite materials and process120US 5,429,856 AMinnesota Mining and Manufacturing Company · 1995
- Tamper indicating labels106US 4,121,003 AMonarch Marking Systems, Inc. · 1978