B28D 5/024
With the stock carried by a movable support for feeding stock into
Official title: {with the stock carried by a movable support for feeding stock into engagement with the cutting blade, e.g. stock carried by a pivoted arm or a carriage}
B28D5/024 (With the stock carried by a movable support for feeding stock into) appears on 82 US grants and 56 published applications in this corpus.
Search patents in B28D- Granted patents
- 82
- Published applications
- 56
- Assignees
- 37
- Inventors
- 143
- Latest grant
- 15 Apr 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 6 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 4 | 0 |
| 2001 | 7 | 6 |
| 2002 | 11 | 12 |
| 2003 | 6 | 2 |
| 2004 | 7 | 4 |
| 2005 | 3 | 3 |
| 2006 | 0 | 2 |
| 2007 | 1 | 5 |
| 2008 | 3 | 2 |
| 2009 | 0 | 0 |
| 2010 | 1 | 2 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 1 | 2 |
| 2014 | 1 | 0 |
| 2015 | 0 | 1 |
| 2016 | 1 | 1 |
| 2017 | 0 | 1 |
| 2018 | 0 | 2 |
| 2019 | 2 | 5 |
| 2020 | 3 | 1 |
| 2021 | 1 | 4 |
| 2022 | 1 | 0 |
| 2023 | 2 | 0 |
| 2024 | 2 | 0 |
| 2025 | 1 | 0 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Sample preparation saw15 Apr 2025US 12,275,075 B2Illinois Tool Works Inc.
- Edge alignment method26 Nov 2024US 12,151,401 B2Disco Corporation
- Cutting apparatus capable of detecting configuration abnormalities of a cutting blade12 Mar 2024US 11,927,934 B2Disco Corporation
- Processing apparatus21 Nov 2023US 11,820,042 B2Disco Corporation
- Method for machining workpiece21 Feb 2023US 11,587,831 B2Disco Corporation
- Sawing Device for Forming Saw-Cuts into a Semiconductor Product and Method Therefor23 Jul 2026US 2026/0208392 A1Besi Netherlands B.V.
- Edge alignment method23 Sep 2021US 2021/0291404 A1Disco Corporation
- Cutting apparatus6 May 2021US 2021/0132567 A1Disco Corporation
- Method for machining workpiece22 Apr 2021US 2021/0118735 A1Disco Corporation
- Processing apparatus15 Apr 2021US 2021/0107180 A1Disco Corporation
Most cited
By later US patents
- Method for sawing wafers employing multiple indexing techniques for multiple die dimensions289US 6,578,458 B1Micron Technology, Inc. · 2003
- Semiconductor wafer dicing machine82US 4,688,540 ADisco Abrasive Systems, Ltd. · 1987
- Cutting method and apparatus for sectioning multilayer electronic devices46US 6,276,355 B1Macro Energy-Tech, Inc. · 2001
- Apparatus for holding workpiece by suction38US 4,131,267 ADisco Corporation · 1978
- Dual-cutting method devoid of useless strokes38US 6,606,985 B2Disco Corporation · 2003