Cutting method and apparatus for sectioning multilayer electronic devices

Slicing apparatus for cutting individual slices out of sheets fabricated with multiple layers of materials comprising:

• a grinding wheel with a first width set to cut a groove into the sheet to a first depth that extends through fewer than all of said layers;
• and
• a cutting wheel positioned in tandem relation with the grinding wheel, but set to cut from said groove to a second depth that extends through all of said layers, said cutting wheel having a second width that is less than said first width.

Slicing apparatus for cutting slices out of a sheet fabricated with multiple layers of materials, comprising:

• a multi-stage grinding wheel with (i) a first stage annular grinding surface that has a first stage width and a first stage diameter and (ii) a second stage annular grinding surface that has a second stage diameter larger than said first stage diameter and is positioned concentrically with, and radially outward from said first stage annular grinding surface, said second stage annular grinding surface having a second stage width that is less than said first stage width;
• and
• a table adapted to support and retain the sheet adjacent the multi-stage grinding wheel in a position such that the first stage annular grinding surface is set to cut through all of said layers while the second stage annular grinding surface is set to cut through fewer than all of said layers.

Slicing apparatus for cutting slices out of a sheet fabricated with multiple layers of materials, comprising:

• a tapered grinding wheel with a circular periphery spaced radially outward from an axis of rotation, said grinding wheel having an annular tapered grinding surface that extends radially inwardly and laterally outwardly from the circular periphery a sufficient distance such that said annular tapered grinding surface has a radial dimension component large enough to extend through all of the layers of the material;
• a table adapted to support and retain the sheet adjacent the tapered grinding wheel in a position such that the annular tapered grinding surface is set to cut through all of said layers in a manner that each layer is cut a different mean width than adjacent layers.

Slicing apparatus for cutting slices out of a sheet fabricated with multiple layers of materials, each of which has a layer thickness and all of such layer thicknesses together comprising a total sheet thickness that extends from a first side of said sheet to a second side of said sheet, said slicing apparatus comprising:

• a first multi-stage grinding wheel adapted to be positioned adjacent the first side of the sheet and set to cut with a narrower width of the first multi-stage grinding wheel at least half way through the total sheet thickness and to cut with a wider width of the first multi-stage grinding wheel less than half way through the total sheet thickness;
• and
• a second multi-stage grinding wheel adapted to be positioned adjacent the second side of the sheet and set to cut with a narrower width of the second multi-stage grinding wheel at least half way through the total sheet thickness and to cut with a wider width of the second multi-stage grinding wheel less than halfway through the total sheet thickness.

A method of slicing a sheet of laminated materials having at least two layers of deformable electrically conductive materials separated by at least one separator layer in a manner that avoids deforming the electrically conductive layers into electrical contact with each other, comprising:

• grinding a first groove having a first width into said sheet to a depth that extends through at least one of the electrically conductive layers but not through the separator layer;
• and
• cutting from the first groove through both the separator layer and other electrically conductive layer with a cut that has a second width which is narrower than said first width.

A method of slicing a sheet of laminated materials having at least two layers of deformable electrically conductive materials separated by at least one separator layer in a manner that avoids deforming the electrically conductive layers into electrical contact with each other comprising:

• grinding through all the layers of the sheet with a first cut having a first width;
• and
• grinding into said sheet with a groove having a second width that extends laterally from said first cut to a depth that extends through at least one of the electrically conductive layers but not through the separator layer.

A method of slicing a sheet of laminated materials having at least two layers of deformable, electrically conductive materials separated by at least one separator layer, comprising:

• cutting through all the layers of the sheet with a first cut having a first width;
• and
• grinding into said sheet with a grinding surface to create a groove having a second width, which is greater than said first width, and which extends through at least one of the electrically conductive layers but not through another of the electrically conductive layers that is separated from said one, of the electrically conductive layers by the separator layer.