Cutting apparatus capable of detecting configuration abnormalities of a cutting blade
AssigneeDisco Corporation
InventorsTsuyoshi Kasai, Ayako Koike
Life of this patent
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AssigneeDisco Corporation
InventorsTsuyoshi Kasai, Ayako Koike
Estimating the term…
A cutting apparatus includes a management unit having a measuring unit for measuring an amount of light emitted from a light emitter and received by a light receiver while a cutting blade is positioned between the light emitter and the light receiver, a measured waveform forming section for forming a measured waveform representing the configuration of an outer circumferential region of the cutting blade, and an ideal waveform recognizing section for recognizing one of the comparative waveforms that has the greatest number of waveform regions similar to the measured waveform as an ideal waveform, a difference calculating section for calculating the area of a region where there is a difference between the measured waveform and the ideal waveform.
A cutting apparatus comprising:
A cutting apparatus comprising:
Dependencies are inferred from the claim text.